发明授权
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
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申请号: US11148208申请日: 2005-06-09
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公开(公告)号: US07279727B2公开(公告)日: 2007-10-09
- 发明人: Daisaku Ikoma , Atsuhiro Kajiya , Katsuhiro Ootani , Kyoji Yamashita
- 申请人: Daisaku Ikoma , Atsuhiro Kajiya , Katsuhiro Ootani , Kyoji Yamashita
- 申请人地址: JP Osaka
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: McDermott Will & Emery LLP
- 优先权: JP2004-213903 20040722
- 主分类号: H01L27/10
- IPC分类号: H01L27/10
摘要:
A semiconductor device includes a semiconductor substrate; a diffusion region which is formed in the semiconductor substrate and serves as a region for the formation of a MIS transistor; an element isolation region surrounding the diffusion region; at least one gate conductor film which is formed across the diffusion region and the element isolation region, includes a gate electrode part located on the diffusion region and a gate interconnect part located on the element isolation region, and has a constant dimension in the gate length direction; and an interlayer insulating film covering the gate electrode. The semiconductor device further includes a gate contact which passes through the interlayer insulating film, is connected to the gate interconnect part, and has the dimension in the gate length direction larger than the gate interconnect part.
公开/授权文献
- US20060017070A1 Semiconductor device 公开/授权日:2006-01-26
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