发明授权
US07282433B2 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
有权
具有接合焊盘的互连结构和在焊盘上形成凸点位置的方法
- 专利标题： Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
- 专利标题（中）： 具有接合焊盘的互连结构和在焊盘上形成凸点位置的方法
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申请号： US11032975申请日： 2005-01-10
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公开(公告)号： US07282433B2公开(公告)日： 2007-10-16
- 发明人: Sanh D. Tang , Mark E. Tuttle , Keith R. Cook
- 申请人： Sanh D. Tang , Mark E. Tuttle , Keith R. Cook
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 代理机构： Perkins Coie LLP
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
Microelectronic workpieces that have bump sites over bond-pads and methods of fabricating such bump sites. One embodiment of such a workpiece, for example, includes a substrate having a plurality of microelectronic dies comprising integrated circuitry and bond-pads, such as copper bond-pads, electrically coupled to the integrated circuitry. The workpiece further includes (a) a dielectric structure having a plurality of openings with sidewalls projecting from corresponding bond-pads, and (b) a plurality of caps over corresponding bond-pads. The individual caps can include a discrete portion of a barrier layer attached to the bond-pads and the sidewalls of the openings, and a discrete portion of a cap layer on the barrier layer. The caps are electrically isolated from each other and self-aligned with corresponding bond-pads without forming a mask layer over the cap layer.
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