发明授权
- 专利标题： Electro-fluidic interconnect attachment
- 专利标题（中）： 电流互连附件
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申请号： US11202530申请日： 2005-08-12
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公开(公告)号： US07285000B2公开(公告)日： 2007-10-23
- 发明人: Michael Pleskach , Paul Koeneman , Carol Gamlen , Steven R. Snyder
- 申请人： Michael Pleskach , Paul Koeneman , Carol Gamlen , Steven R. Snyder
- 申请人地址： US FL Melbourne
- 专利权人： Harris Corporation
- 当前专利权人： Harris Corporation
- 当前专利权人地址： US FL Melbourne
- 代理机构： Sacco & Associates, PA
- 代理商 Robert J. Sacco
- 主分类号： H01R4/60
- IPC分类号： H01R4/60
摘要：
An electro-fluidic interconnection. The interconnection includes a body (200) formed of a ceramic material. The body (200) is provided with an aperture (206) having a profile suitable for receiving an interconnecting conduit (400). The interconnecting conduit (400) can be formed of the same type of ceramic material as the body (200). The conduit (400) is defined by an outer shell (403) with a hollow bore (402) for transporting a fluid. A mating portion (404) of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion (404) of the conduit (400) can be compression fitted within the aperture (206). Conductive traces (406, 208) on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.
公开/授权文献
- US20070053158A1 Electro-fluidic interconnect attachment 公开/授权日：2007-03-08
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