公开(公告)号：US07607223B2

公开(公告)日：2009-10-27

申请号：US11834797

申请日：2007-08-07

申请人： Mihael Pleskach ,  Paul Koeneman ,  Carol Gamlen ,  Steven R. Snyder

发明人： Mihael Pleskach ,  Paul Koeneman ,  Carol Gamlen ,  Steven R. Snyder

IPC分类号： H05K3/02

CPC分类号： F16L25/01 ,  F16L49/02 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49208

摘要： An electro-fluidic interconnection. The interconnection includes a body (200) formed of a ceramic material. The body (200) is provided with an aperture (206) having a profile suitable for receiving an interconnecting conduit (400). The interconnecting conduit (400) can be formed of the same type of ceramic material as the body (200). The conduit (400) is defined by an outer shell (403) with a hollow bore (402) for transporting a fluid. A mating portion (404) of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion (404) of the conduit (400) can be compression fitted within the aperture (206). Conductive traces (406, 208) on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.

摘要翻译： 电流互连。 互连包括由陶瓷材料形成的主体（200）。 主体（200）设置有具有适于接收互连导管（400）的轮廓的孔（206）。 互连导管（400）可以由与本体（200）相同类型的陶瓷材料形成。 导管（400）由具有用于输送流体的中空孔（402）的外壳（403）限定。 导管的配合部分（404）具有与孔的轮廓匹配的外部轮廓。 此外，导管（400）的配合部分（404）可以压缩配合在孔（206）内。 导管和主体上的导电迹线（406,208）可以电连接以完成电流互连。

公开(公告)号：US06987033B2

公开(公告)日：2006-01-17

申请号：US10921511

申请日：2004-08-19

申请人： Randy T. Pike ,  Charles M. Newton ,  Carol Gamlen ,  Raymond C. Rumpf ,  Betty O'Dowd

发明人： Randy T. Pike ,  Charles M. Newton ,  Carol Gamlen ,  Raymond C. Rumpf ,  Betty O'Dowd

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/4882 ,  H01L21/4857 ,  H01L23/3735 ,  H01L23/427 ,  H01L23/473 ,  H01L24/31 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/83894 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.

公开(公告)号：US07285000B2

公开(公告)日：2007-10-23

申请号：US11202530

申请日：2005-08-12

申请人： Michael Pleskach ,  Paul Koeneman ,  Carol Gamlen ,  Steven R. Snyder

发明人： Michael Pleskach ,  Paul Koeneman ,  Carol Gamlen ,  Steven R. Snyder

IPC分类号： H01R4/60

CPC分类号： F16L25/01 ,  F16L49/02 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49208

摘要： An electro-fluidic interconnection. The interconnection includes a body (200) formed of a ceramic material. The body (200) is provided with an aperture (206) having a profile suitable for receiving an interconnecting conduit (400). The interconnecting conduit (400) can be formed of the same type of ceramic material as the body (200). The conduit (400) is defined by an outer shell (403) with a hollow bore (402) for transporting a fluid. A mating portion (404) of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion (404) of the conduit (400) can be compression fitted within the aperture (206). Conductive traces (406, 208) on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.

摘要翻译： 电流互连。 互连包括由陶瓷材料形成的主体（200）。 主体（200）设置有具有适于接收互连导管（400）的轮廓的孔（206）。 互连导管（400）可以由与本体（200）相同类型的陶瓷材料形成。 导管（400）由具有用于输送流体的中空孔（402）的外壳（403）限定。 导管的配合部分（404）具有与孔的轮廓匹配的外部轮廓。 此外，导管（400）的配合部分（404）可以压缩配合在孔（206）内。 导管和主体上的导电迹线（406,208）可以电连接以完成电流互连。

公开(公告)号：US20050019986A1

公开(公告)日：2005-01-27

申请号：US10921511

申请日：2004-08-19

申请人： Randy Pike ,  Charles Newton ,  Carol Gamlen ,  Raymond Rumpf ,  Betty O'Dowd

发明人： Randy Pike ,  Charles Newton ,  Carol Gamlen ,  Raymond Rumpf ,  Betty O'Dowd

IPC分类号： H01L21/48 ,  H01L23/373 ,  H01L23/427 ,  H01L23/473 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L21/4882 ,  H01L21/4857 ,  H01L23/3735 ,  H01L23/427 ,  H01L23/473 ,  H01L24/31 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/83894 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.

摘要翻译： 一种制造电子设备的方法包括定位第一和第二构件，使得其相对表面彼此接触，第一构件包括硅，第二构件包括低温共烧陶瓷（LTCC）材料。 该方法还包括将第一和第二构件的相对表面阳极结合在一起，以在其间形成气密密封。 阳极接合在不使用粘合剂的情况下在构件之间提供牢固且牢固的结合。 该方法还可以包括在第一和第二构件中的至少一个中形成至少一个冷却结构。 至少一个冷却结构可以包括第一构件中的至少一个第一微流体冷却结构，以及与第一微流体冷却结构对准的第二构件中的至少一个第二微流体冷却结构。

公开(公告)号：US06738600B1

公开(公告)日：2004-05-18

申请号：US09632701

申请日：2000-08-04

申请人： Charles M. Newton ,  Raymond C. Rumpf ,  Carol Gamlen

发明人： Charles M. Newton ,  Raymond C. Rumpf ,  Carol Gamlen

IPC分类号： H04B338

CPC分类号： B81C1/0015 ,  B81B2201/0271 ,  B81C2201/0109 ,  H01H59/0009 ,  H01P1/127 ,  H05K1/092 ,  H05K3/02 ,  Y10T29/49117 ,  Y10T428/24926 ,  Y10T428/2495

摘要： A microelectromechanical structure and method is disclosed. A ceramic substrate preferably is formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can be a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. In one aspect of the invention, a switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.

摘要翻译： 公开了一种微机电结构和方法。 陶瓷基板优选由低温共烧陶瓷片形成。 在陶瓷基板的一个表面上形成低损耗可光限定介电平面化层。 该层可以是牺牲层或随后的牺牲层。 在低损耗介电平面化层上印刷光致定导体，并将牺牲层形成为结构电路部件。 在本发明的一个方面，开关形成有偏置致动器和可偏转构件，该偏置致动器和偏转构件形成在偏置致动器上方并且可移动到打开和闭合的位置。

公开(公告)号：US20080141529A1

公开(公告)日：2008-06-19

申请号：US11834797

申请日：2007-08-07

申请人： Michael Pleskach ,  Paul Koeneman ,  Carol Gamlen ,  Steven R. Snyder

发明人： Michael Pleskach ,  Paul Koeneman ,  Carol Gamlen ,  Steven R. Snyder

IPC分类号： H01R43/16

CPC分类号： F16L25/01 ,  F16L49/02 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49208

摘要： An electro-fluidic interconnection. The interconnection includes a body (200) formed of a ceramic material. The body (200) is provided with an aperture (206) having a profile suitable for receiving an interconnecting conduit (400). The interconnecting conduit (400) can be formed of the same type of ceramic material as the body (200). The conduit (400) is defined by an outer shell (403) with a hollow bore (402) for transporting a fluid. A mating portion (404) of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion (404) of the conduit (400) can be compression fitted within the aperture (206). Conductive traces (406, 208) on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.

摘要翻译： 电流互连。 互连包括由陶瓷材料形成的主体（200）。 主体（200）设置有具有适于接收互连导管（400）的轮廓的孔（206）。 互连导管（400）可以由与本体（200）相同类型的陶瓷材料形成。 导管（400）由具有用于输送流体的中空孔（402）的外壳（403）限定。 导管的配合部分（404）具有与孔的轮廓匹配的外部轮廓。 此外，导管（400）的配合部分（404）可以压缩配合在孔（206）内。 导管和主体上的导电迹线（406,208）可以电连接以完成电流互连。

公开(公告)号：US07035591B2

公开(公告)日：2006-04-25

申请号：US10827004

申请日：2004-04-19

申请人： Charles M. Newton ,  Raymond C. Rumpf ,  Carol Gamlen

发明人： Charles M. Newton ,  Raymond C. Rumpf ,  Carol Gamlen

IPC分类号： H04B3/38

CPC分类号： B81C1/0015 ,  B81B2201/0271 ,  B81C2201/0109 ,  H01H59/0009 ,  H01P1/127 ,  H05K1/092 ,  H05K3/02 ,  Y10T29/49117 ,  Y10T428/24926 ,  Y10T428/2495

摘要： A microelectromechanical structure and method is disclosed. A ceramic substrate preferably is formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can e a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. In one aspect of the invention, a switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.

摘要翻译： 公开了一种微机电结构和方法。 陶瓷基板优选由低温共烧陶瓷片形成。 在陶瓷基板的一个表面上形成低损耗可光限定介电平面化层。 该层可以添加牺牲层或随后的牺牲层。 在低损耗介电平面化层上印刷光致定导体，并将牺牲层形成为结构电路部件。 在本发明的一个方面，开关形成有偏置致动器和可偏转构件，该偏置致动器和偏转构件形成在偏置致动器上方并且可移动到打开和闭合的位置。

公开(公告)号：US06809424B2

公开(公告)日：2004-10-26

申请号：US09741754

申请日：2000-12-19

申请人： Randy T. Pike ,  Charles M. Newton ,  Carol Gamlen ,  Raymond C. Rumpf ,  Betty O'Dowd

发明人： Randy T. Pike ,  Charles M. Newton ,  Carol Gamlen ,  Raymond C. Rumpf ,  Betty O'Dowd

IPC分类号： H01L2348

CPC分类号： H01L21/4882 ,  H01L21/4857 ,  H01L23/3735 ,  H01L23/427 ,  H01L23/473 ,  H01L24/31 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/83894 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.

摘要翻译： 一种制造电子设备的方法包括定位第一和第二构件，使得其相对表面彼此接触，第一构件包括硅，第二构件包括低温共烧陶瓷（LTCC）材料。 该方法还包括将第一和第二构件的相对表面阳极结合在一起，以在其间形成气密密封。 阳极接合在不使用粘合剂的情况下在构件之间提供牢固且牢固的结合。 该方法还可以包括在第一和第二构件中的至少一个中形成至少一个冷却结构。 至少一个冷却结构可以包括第一构件中的至少一个第一微流体冷却结构，以及与第一微流体冷却结构对准的第二构件中的至少一个第二微流体冷却结构。

公开(公告)号：US20070053158A1

公开(公告)日：2007-03-08

申请号：US11202530

申请日：2005-08-12

申请人： Michael Pleskach ,  Paul Koeneman ,  Carol Gamlen ,  Steven Snyder

发明人： Michael Pleskach ,  Paul Koeneman ,  Carol Gamlen ,  Steven Snyder

IPC分类号： H05K7/20

CPC分类号： F16L25/01 ,  F16L49/02 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49208

摘要： An electro-fluidic interconnection. The interconnection includes a body (200) formed of a ceramic material. The body (200) is provided with an aperture (206) having a profile suitable for receiving an interconnecting conduit (400). The interconnecting conduit (400) can be formed of the same type of ceramic material as the body (200). The conduit (400) is defined by an outer shell (403) with a hollow bore (402) for transporting a fluid. A mating portion (404) of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion (404) of the conduit (400) can be compression fitted within the aperture (206). Conductive traces (406, 208) on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.

公开(公告)号：US20050068726A1

公开(公告)日：2005-03-31

申请号：US10670480

申请日：2003-09-25

申请人： Michael Pleskach ,  Paul Koeneman ,  Brian Smith ,  Charles Newton ,  Carol Gamlen

发明人： Michael Pleskach ,  Paul Koeneman ,  Brian Smith ,  Charles Newton ,  Carol Gamlen

IPC分类号： H01L21/44 ,  H01L23/373 ,  H01L23/473 ,  H01L23/498 ,  H05K7/20

CPC分类号： H01L23/3731 ,  H01L23/473 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10T137/87885 ,  H01L2924/00

摘要： An electro-fluidic device may include a substrate having at least one substrate fluid passageway therein, and at least one substrate electrical conductor carried by the substrate. Moreover, an external interface may be spaced from the substrate and include at least one interface electrical conductor. The electro-fluidic device may also include at least one electro-fluidic interconnect extending between the substrate and the external interface. More particularly, the at least one electro-fluidic interconnect may include an interconnect body having at least one interconnect fluid passageway extending therethrough and connected to the at least one substrate fluid passageway, and at least one interconnect electrical conductor carried by the interconnect body. The at least one interconnect electrical conductor may connect the at least one substrate electrical conductor and the at least one interface electrical connector.

摘要翻译： 电流装置可以包括其中具有至少一个衬底流体通道的衬底和由衬底承载的至少一个衬底电导体。 此外，外部接口可以与衬底间隔开并且包括至少一个接口电导体。 电流装置还可以包括在衬底和外部接口之间延伸的至少一个电流互连。 更具体地，至少一个电流互连可以包括互连体，其具有延伸穿过其中并连接到至少一个衬底流体通道的至少一个互连流体通道以及由互连体携带的至少一个互连电导体。 所述至少一个互连电导体可以连接所述至少一个基板电导体和所述至少一个接口电连接器。