发明授权
US07285792B2 Scratch repairing processing method and scanning probe microscope (SPM) used therefor
有权
刮擦修复处理方法和扫描探针显微镜(SPM)
- 专利标题: Scratch repairing processing method and scanning probe microscope (SPM) used therefor
- 专利标题(中): 刮擦修复处理方法和扫描探针显微镜(SPM)
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申请号: US11086812申请日: 2005-03-21
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公开(公告)号: US07285792B2公开(公告)日: 2007-10-23
- 发明人: Naoya Watanabe , Osamu Takaoka
- 申请人: Naoya Watanabe , Osamu Takaoka
- 申请人地址: JP
- 专利权人: SII NanoTechnology Inc.
- 当前专利权人: SII NanoTechnology Inc.
- 当前专利权人地址: JP
- 代理机构: Adams & Wilks
- 优先权: JP2004-082214 20040322
- 主分类号: G01B5/28
- IPC分类号: G01B5/28
摘要:
A sample to be processed is disposed within a processing cell which contains a liquid. Scratch processing using a scanning probe microscope is performed within the liquid so that chips or shavings removed from the sample scatter within the liquid rather than collecting on the surface of the sample. The processing cell has a supply port and a discharge port so that new liquid can be supplied within the cell through the supply port after the termination of the scratch processing to clean the cell. In this manner, chips or shavings generated by scratch processing a defect portion of the sample can be removed completely without being collected at the surface of a sample despite the surface tension of adsorbed water existing on the sample surface and/or electrostatic charges caused by friction.
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