发明授权
- 专利标题： Carrier for stacked type semiconductor device and method of fabricating the same
- 专利标题（中）： 层叠型半导体器件用载体及其制造方法
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申请号： US11126739申请日： 2005-05-11
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公开(公告)号： US07285848B2公开(公告)日： 2007-10-23
- 发明人: Masanori Onodera , Junichi Kasai , Kouichi Meguro , Junji Tanaka , Yasuhiro Shinma , Koji Taya
- 申请人： Masanori Onodera , Junichi Kasai , Kouichi Meguro , Junji Tanaka , Yasuhiro Shinma , Koji Taya
- 申请人地址： US CA Sunnyvale
- 专利权人： Spansion LLC
- 当前专利权人： Spansion LLC
- 当前专利权人地址： US CA Sunnyvale
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A carrier for a stacked type semiconductor device includes a lower carrier having a first accommodating portion that accommodates a first semiconductor device, and an upper carrier having a second accommodating portion that accommodates a second semiconductor device stacked on the first semiconductor device so as to be placed in position on the first semiconductor device. It is thus possible to eliminate an additional device used for stacking the semiconductor device, and thereby reduce the cost.
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