发明授权
- 专利标题: Wire bonding method and semiconductor device
- 专利标题(中): 引线接合方法和半导体器件
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申请号: US11063866申请日: 2005-02-24
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公开(公告)号: US07285854B2公开(公告)日: 2007-10-23
- 发明人: Katsumi Ishikawa , Nobuya Makino , Hiroshi Takei
- 申请人: Katsumi Ishikawa , Nobuya Makino , Hiroshi Takei
- 申请人地址: JP Kariya
- 专利权人: DENSO Corporation
- 当前专利权人: DENSO Corporation
- 当前专利权人地址: JP Kariya
- 代理机构: Posz Law Group, PLC
- 优先权: JP2004-078244 20040318
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H01L23/52 ; H01L29/40
摘要:
A wire bonding method for bonding a plurality of conducting wires to connect first conductors and second conductors has the following steps. 1) Bonding a first conducting ball on a first first conductor. 2) Bonding a first conducting wire on the first conducting ball, the first conducting wire being connected to a first second conductor. 3) Bonding a second conducting ball on a second first conductor. 4) Bonding a second conducting wire on the second conducting ball, the second conducting wire being connected to a second second conductor. Here, the second first conductor or the second second conductor is the first conducting wire bonded on the first conducting ball.
公开/授权文献
- US20050205995A1 Wire bonding method and semiconductor device 公开/授权日:2005-09-22
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