发明授权
- 专利标题： Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board
- 专利标题（中）： 具有内置无源器件的印刷电路板，印刷电路板的制造方法和用于印刷电路板的元件板
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申请号： US10339655申请日： 2003-01-10
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公开(公告)号： US07286367B2公开(公告)日： 2007-10-23
- 发明人: Toshihiro Miyake , Satoshi Takeuchi , Koji Kondo , Toshikazu Harada , Masayuki Aoyama , Yoshitaro Yazaki , Kazuo Tada , Yoshihiko Shiraishi , Yosuke Ozaki , Katsumi Yamazaki , Seiji Konishi , Seiichi Shindou
- 申请人： Toshihiro Miyake , Satoshi Takeuchi , Koji Kondo , Toshikazu Harada , Masayuki Aoyama , Yoshitaro Yazaki , Kazuo Tada , Yoshihiko Shiraishi , Yosuke Ozaki , Katsumi Yamazaki , Seiji Konishi , Seiichi Shindou
- 申请人地址： JP Kariya
- 专利权人： DENSO CORPORATION
- 当前专利权人： DENSO CORPORATION
- 当前专利权人地址： JP Kariya
- 代理机构： Posz Law Group, PLC
- 优先权： JP2002-004672 20020111; JP2002-060797 20020306; JP2002-223645 20020731
- 主分类号： H05K1/16
- IPC分类号： H05K1/16
摘要：
A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.
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