发明授权
US07286370B2 Wired circuit board and connection structure of wired circuit board
有权
有线电路板和有线电路板的连接结构
- 专利标题： Wired circuit board and connection structure of wired circuit board
- 专利标题（中）： 有线电路板和有线电路板的连接结构
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申请号： US11135511申请日： 2005-05-24
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公开(公告)号： US07286370B2公开(公告)日： 2007-10-23
- 发明人: Yasunari Ooyabu
- 申请人： Yasunari Ooyabu
- 申请人地址： JP Ibaraki-shi, Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Ibaraki-shi, Osaka
- 代理机构： Akerman Senterfitt
- 代理商 Jean C. Edwards, Esq
- 优先权： JP2004-155107 20040525
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K1/14
摘要：
A wired circuit board is provided that is formed by connecting a first wired circuit board and a second wired circuit board, which include a first connection terminal and a second connection terminal, respectively. A solder bump is provided to continuously extend over surfaces of the first connection terminal and the second connection terminal to mechanically couple the first wired circuit board and the second wired circuit board. Consequently, the solder bump is not interposed between opposed surfaces of the first connection terminal and the second connection terminal, thereby allowing the electrical connection provided by the solder bump to be confirmed by visual observation.
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