公开(公告)号：US08877528B2

公开(公告)日：2014-11-04

申请号：US13446611

申请日：2012-04-13

申请人： Yasunari Ooyabu ,  Toshiki Naito ,  Satoshi Sato

发明人： Yasunari Ooyabu ,  Toshiki Naito ,  Satoshi Sato

IPC分类号： H01L21/00 ,  H01L33/56 ,  H01L33/46 ,  H01L33/00

CPC分类号： H01L33/56 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/46 ,  H01L2224/16 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

摘要： A method for producing a light emitting transfer sheet includes the steps of preparing a light emitting element sheet including a light semiconductor layer connected to an electrode portion on one side surface and a phosphor layer laminated on the other side surface; dividing the light emitting element sheet into plural pieces to form a plurality of light emitting elements; disposing a plurality of the light emitting elements on a substrate to be spaced apart from each other; forming a reflecting resin layer containing a light reflecting component on the substrate so as to cover the light emitting elements; and removing the reflecting resin layer partially so that one side surface of the electrode portion is exposed from the reflecting resin layer.

摘要翻译： 发光转印片的制造方法包括以下步骤：制备包括连接到一个侧表面上的电极部分的光半导体层和层压在另一个侧表面上的荧光体层的发光元件片材; 将发光元件片分割成多个片以形成多个发光元件; 将多个发光元件设置在基板上以彼此间隔开; 在所述基板上形成包含光反射部件的反射树脂层以覆盖所述发光元件; 并且部分地去除反射树脂层，使得电极部分的一个侧表面从反射树脂层露出。

公开(公告)号：US08680557B2

公开(公告)日：2014-03-25

申请号：US13431240

申请日：2012-03-27

申请人： Yuki Shinbori ,  Yasunari Ooyabu ,  Satoshi Sato ,  Hisataka Ito

发明人： Yuki Shinbori ,  Yasunari Ooyabu ,  Satoshi Sato ,  Hisataka Ito

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/56 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/13 ,  H01L2933/005

摘要： A method for producing a light emitting diode device includes the steps of preparing a phosphor layer formed in a sheet state; forming a light semiconductor layer on one surface in a thickness direction of the phosphor layer; forming an electrode portion on one surface of the light semiconductor layer; forming an encapsulating resin layer containing a light reflecting component so as to cover the light semiconductor layer and the electrode portion; producing the light emitting diode element by partially removing the encapsulating resin layer so as to expose one surface of the electrode portion; and allowing the electrode portion to be electrically connected to the terminal, so that the light emitting diode element is flip-chip mounted on the base board.

摘要翻译： 一种发光二极管器件的制造方法，其特征在于，具有：制作以片状形成的荧光体层的工序; 在所述荧光体层的厚度方向的一个表面上形成光半导体层; 在所述光半导体层的一个表面上形成电极部分; 形成包含光反射部件的封装树脂层，以覆盖所述光半导体层和所述电极部分; 通过部分地去除封装树脂层来制造发光二极管元件，以暴露电极部分的一个表面; 并且允许电极部分电连接到端子，使得发光二极管元件倒装芯片安装在基板上。

公开(公告)号：US08647517B2

公开(公告)日：2014-02-11

申请号：US12216589

申请日：2008-07-08

申请人： Takahiko Yokai ,  Yasunari Ooyabu ,  Toshiki Naito

发明人： Takahiko Yokai ,  Yasunari Ooyabu ,  Toshiki Naito

IPC分类号： H01B13/00 ,  B44C1/22

CPC分类号： G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/108 ,  H05K3/44 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0323 ,  H05K2203/056

摘要： A producing method of a suspension board with circuit includes simultaneously forming a conductive pattern formed on an insulating layer formed on a metal supporting board and having a terminal portion for connecting to an electronic component, and a mark formed on the metal supporting board, or on the insulating layer and having an opening for forming a reference hole for mounting the electronic component, and forming the reference hole by etching the metal supporting board disposed in the opening of the mark, or the insulating layer and the metal supporting board each disposed in the opening of the mark.

摘要翻译： 具有电路的悬挂板的制造方法包括同时形成形成在金属支撑板上的绝缘层上的导电图案，并且具有用于连接到电子部件的端子部分，以及形成在金属支撑板上的标记， 所述绝缘层具有用于形成用于安装所述电子部件的基准孔的开口，并且通过蚀刻设置在所述标记的开口中的所述金属支撑板，或者设置在所述绝缘层和所述金属支撑板上而形成所述基准孔 打开标记。

公开(公告)号：US08233287B2

公开(公告)日：2012-07-31

申请号：US12024857

申请日：2008-02-01

申请人： Alex Cayaban ,  Szu-Han Hu ,  Yasunari Ooyabu ,  Martin John McCaslin

发明人： Alex Cayaban ,  Szu-Han Hu ,  Yasunari Ooyabu ,  Martin John McCaslin

IPC分类号： H05K7/10

CPC分类号： G11B33/1426 ,  G11B33/123 ,  H05K1/0206 ,  H05K1/056 ,  H05K1/189 ,  H05K2201/09509 ,  H05K2201/09554

摘要： Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer. In one implementation, the heat removing element includes a rectangular plate having a recessed center portion and an edge portion. The recessed center portion protrudes through the at least one via in the insulating layer to mechanically couple with the stiffener. In another implementation, the heat removing element includes first portion and second rectangular portions. The first portion protrudes through the at least one via in the insulating layer to thermally couple with the stiffener and the second portion is disposed over the insulating layer, such that the second portion can be thermally coupled to the preamp.

摘要翻译： 描述了一种用于硬盘驱动器的前置放大器柔性电缆。 柔性电缆包括可操作以提供机械支撑件的加强层，设置在加强层上的绝缘层，并且具有设置在其中的至少一个通孔以露出加强层，以及设置在绝缘层上的至少一个导电层。 所述至少一个导电层形成电路和至少一个散热元件，其延伸穿过所述通孔并与所述加强层建立接触。 在一个实施方式中，除热元件包括具有凹入的中心部分和边缘部分的矩形板。 凹陷的中心部分穿过绝缘层中的至少一个通孔突出以与加强件机械地联接。 在另一实施方式中，除热元件包括第一部分和第二矩形部分。 第一部分穿过绝缘层中的至少一个通孔突出，以与加强件热耦合，并且第二部分设置在绝缘层上方，使得第二部分可以热耦合到前置放大器。

公开(公告)号：US08164002B2

公开(公告)日：2012-04-24

申请号：US12004038

申请日：2007-12-20

申请人： Jun Ishii ,  Yasunari Ooyabu

发明人： Jun Ishii ,  Yasunari Ooyabu

IPC分类号： H05K1/03

CPC分类号： H05K1/0259 ,  G11B5/486 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0329

摘要： A wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a first semiconductive layer formed on a surface of the insulating base layer exposed from the conductive pattern, an insulating cover layer formed on the conductive pattern and the first semiconductive layer and a second semiconductive layer formed on a surface of the insulating cover layer. The first semiconductive layer is electrically connected to the conductive pattern and the metal supporting board, and the second semiconductive layer is electrically connected to the metal supporting board.

摘要翻译： 布线电路板包括金属支撑板，形成在金属支撑板上的绝缘基底层，形成在绝缘基底层上的导电图案，形成在从导电图案露出的绝缘基底层的表面上的第一半导体层， 形成在导电图案和第一半导体层上的绝缘覆盖层和形成在绝缘覆盖层的表面上的第二半导体层。 第一半导电层电连接到导电图案和金属支撑板，并且第二半导体层电连接到金属支撑板。

公开(公告)号：US07782571B2

公开(公告)日：2010-08-24

申请号：US11783024

申请日：2007-04-05

申请人： Jun Ishii ,  Yasunari Ooyabu

发明人： Jun Ishii ,  Yasunari Ooyabu

IPC分类号： G11B5/48

CPC分类号： G11B5/486 ,  H05K1/0259 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28

摘要： A wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a first semi-conductive layer formed on the conductive pattern, an insulating cover layer formed on the first semi-conductive layer, and a second semi-conductive layer formed on the insulating cover layer. The first semi-conductive layer and the second semi-conductive layer are electrically connected to the metal supporting board.

摘要翻译： 布线电路板包括金属支撑板，形成在金属支撑板上的绝缘基底层，形成在绝缘基底层上的导电图案，形成在导电图案上的第一半导电层，形成在绝缘覆盖层上的绝缘覆盖层 第一半导体层和形成在绝缘覆盖层上的第二半导体层。 第一半导体层和第二半导电层电连接到金属支撑板。

公开(公告)号：US07694416B2

公开(公告)日：2010-04-13

申请号：US11987976

申请日：2007-12-06

申请人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

发明人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

IPC分类号： H05K3/02

CPC分类号： H05K1/0259 ,  H05K1/056 ,  H05K1/167 ,  H05K3/244 ,  H05K3/28 ,  H05K3/3473 ,  H05K2201/0329 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156

摘要： A producing method of a wired circuit board includes the steps of preparing a wired circuit board having an insulating layer and a conductive pattern including a wire covered with the insulating layer and a terminal portion exposed from the insulating layer, disposing a contact member formed of a material having a standard electrode potential lower than that of a conductive material forming the conductive pattern such that the contact member is in contact with the conductive pattern and exposed from the insulating layer, and dipping the wired circuit board including the disposed contact member in a polymerization solution of a conductive polymer to form a semiconductive layer on the surface of the insulating layer.

摘要翻译： 一种布线电路板的制造方法，其特征在于，具有：制作具有绝缘层的布线电路基板和包含被绝缘层覆盖的导线图案的布线电路基板和从绝缘层露出的端子部，配置由 具有比形成导电图案的导电材料的标准电极电位低的材料，使得接触构件与导电图案接触并从绝缘层露出，并将包括所设置的接触构件的布线电路板浸入聚合 导电聚合物的溶液以在绝缘层的表面上形成半导体层。

公开(公告)号：US20090044969A1

公开(公告)日：2009-02-19

申请号：US12219343

申请日：2008-07-21

申请人： Jun Ishii ,  Yasunari Ooyabu ,  Takeshi Tanaka ,  Toshiki Naito

发明人： Jun Ishii ,  Yasunari Ooyabu ,  Takeshi Tanaka ,  Toshiki Naito

IPC分类号： H05K1/14

CPC分类号： H05K3/363 ,  H05K1/056 ,  H05K1/117 ,  H05K1/142 ,  H05K2201/058 ,  H05K2201/09145 ,  H05K2201/09381 ,  H05K2203/167

摘要： A wired circuit board includes a first wired circuit board and a second wired circuit board disposed to be opposed to the first wired circuit board in the same plane. A first opposed surface of the first wired circuit board facing the second wired circuit board and a second opposed surface of the second wired circuit board facing the first wired circuit board include at least two types of interfitting surfaces extending in different directions so as to mutually interfit the first opposed surface with the second opposed surface.

摘要翻译： 布线电路板包括第一布线电路板和布置成与同一平面中的第一布线电路板相对的第二布线电路板。 面向第二布线电路板的第一布线电路板的第一相对表面和面对第一布线电路板的第二布线电路板的第二相对表面包括沿不同方向延伸的至少两种类型的配合表面，以便相互配合 具有第二相对表面的第一相对表面。

公开(公告)号：US20080102609A1

公开(公告)日：2008-05-01

申请号：US11976235

申请日：2007-10-23

申请人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

发明人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

IPC分类号： H01L21/20

CPC分类号： H05K1/0259 ,  H05K3/28 ,  H05K2201/0329 ,  H05K2203/1157

摘要： A method for producing a wired circuit board includes the steps of preparing a wired circuit board including an insulating layer and a conductive pattern having a wire covered with the insulating layer and a terminal portion exposed from the insulating layer, and forming a semiconductive layer on a surface of the insulating layer by dipping the wired circuit board in a polymeric liquid of a conductive polymer. An oxidation-reduction potential of the polymeric liquid of the conductive polymer is lower than a standard electrode potential of a conductive material forming the conductive pattern.

摘要翻译： 一种布线电路板的制造方法，其特征在于，包括以下步骤：制作布线电路基板，所述布线电路基板包括绝缘层和具有被所述绝缘层覆盖的导线的导电图案和从所述绝缘层露出的端子部，以及在所述绝缘层上形成半导体层 通过将布线电路板浸渍在导电聚合物的聚合物液体中来形成绝缘层的表面。 导电聚合物的聚合物液体的氧化还原电位低于形成导电图案的导电材料的标准电极电位。

公开(公告)号：US20080102608A1

公开(公告)日：2008-05-01

申请号：US11976234

申请日：2007-10-23

申请人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

发明人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

IPC分类号： H01L21/20

CPC分类号： H05K1/0259 ,  H05K3/28 ,  H05K2201/0329 ,  H05K2203/135

摘要： A producing method of a wired circuit board includes the step of preparing a wired circuit board including an insulating layer and a conductive pattern having a wire covered with the insulating layer and a terminal portion exposed from the insulating layer; and the step of forming a semiconductive layer on a surface of the insulating layer by dipping the wired circuit board in a polymeric liquid of a conductive polymer in which an electrode is provided, and applying a voltage so that the electrode becomes an anode and the conductive pattern becomes a cathode.

摘要翻译： 一种布线电路板的制造方法，其特征在于，包括：制作布线电路基板的步骤，所述布线电路基板包括绝缘层和具有被绝缘层覆盖的导线的导电图案和从所述绝缘层露出的端子部分; 以及通过将布线电路板浸渍在其中提供电极的导电聚合物的聚合物液体中并且施加电压使得电极变为阳极并且导电的方式在绝缘层的表面上形成半导体层的步骤 图案变成阴极。