发明授权
- 专利标题: Semiconductor light emitting device and semiconductor light emitting unit
- 专利标题(中): 半导体发光器件和半导体发光单元
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申请号: US11149461申请日: 2005-06-10
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公开(公告)号: US07291866B2公开(公告)日: 2007-11-06
- 发明人: Hiroaki Oshio , Iwao Matsumoto , Takeshi Miyakawa , Hatsuo Takezawa
- 申请人: Hiroaki Oshio , Iwao Matsumoto , Takeshi Miyakawa , Hatsuo Takezawa
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Banner & Witcoff, Ltd.
- 优先权: JP2004-174455 20040611
- 主分类号: H01L29/22
- IPC分类号: H01L29/22
摘要:
A semiconductor light emitting device comprises: embedding resin; a first lead having a first inner lead section embedded in the embedding resin and a first outer lead section protruding from one side face of the embedding resin; a second lead having a second inner lead section embedded in the embedding resin and a second outer lead section protruding from a side face opposed to the one side face of the embedding resin; a semiconductor light emitting chip mounted on a portion of the first inner lead section exposed in a recess provided on an upper face of the embedding resin; and a wire connecting the semiconductor light emitting chip with the second lead. The first and second inner lead sections and the first and second outer lead sections each have a substantially coplanar rear face. At least a part of the rear face of the first inner lead section and at least a part of the rear face of the second inner lead section are not covered with the embedding resin but are exposed.