发明授权
- 专利标题: Chip component and method for producing a chip component
- 专利标题(中): 芯片部件及芯片部件的制造方法
-
申请号: US11304491申请日: 2005-12-15
-
公开(公告)号: US07291902B2公开(公告)日: 2007-11-06
- 发明人: Youssef Gannoune , Christian Stocken
- 申请人: Youssef Gannoune , Christian Stocken
- 申请人地址: DE Munich
- 专利权人: Infineon Technologies AG
- 当前专利权人: Infineon Technologies AG
- 当前专利权人地址: DE Munich
- 代理机构: Slater & Matsil, L.L.P.
- 优先权: DE102004060367 20041215
- 主分类号: H01L23/02
- IPC分类号: H01L23/02
摘要:
A chip component (1) includes a semiconductor body (2), in which at least one switchable element (6, 62) is arranged in a partial region (24) of the semiconductor body (2). The partial region (24) can be reached by light of at least one wavelength. Furthermore, a circuit (9) integrated into the semiconductor body (2) is provided, which integrated circuit can assume one configuration from at least two possible configurations, one of these configurations being prescribed by a state of the at least one switchable element (6, 62). Furthermore, a housing (3) is provided, which encloses the semiconductor body (2) and is arranged with a partial region (35, 32) at least partly above the partial region (24) of the semiconductor body (2). The partial region (35, 32) of the housing (3) is formed in such a way that light can be fed to the partial region (24) of the semiconductor body (2). It is thus possible even after a fabrication process to carry out a test and, if appropriate, to define a different configuration through switching of the element (6, 62).
公开/授权文献
- US20060163600A1 Chip component and method for producing a chip component 公开/授权日:2006-07-27
信息查询
IPC分类: