发明授权
- 专利标题： Collimated and long throw magnetron sputtering of nickel/iron films for magnetic recording head applications
- 专利标题（中）： 用于磁记录头应用的镍/铁膜的准直和长距离磁控溅射
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申请号： US09138429申请日： 1998-08-24
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公开(公告)号： US07294242B1公开(公告)日： 2007-11-13
- 发明人: Imran Hashim , Seh-Kwang Lee , Thomas Brezoczky , Sesh Ramaswami
- 申请人： Imran Hashim , Seh-Kwang Lee , Thomas Brezoczky , Sesh Ramaswami
- 申请人地址： US CA SAnta Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA SAnta Clara
- 代理商 Charles S. Guenzer
- 主分类号： C23C14/00
- IPC分类号： C23C14/00 ; C23C14/32
摘要：
An apparatus and method for sputter depositing a magnetic film on a substrate to produce a magnetic device such as magnetic recording heads for reading digital information from a storage medium. The apparatus of the invention includes a sputtering chamber containing a target and a substrate, and a magnet array disposed within the chamber to form a substantially parallel magnetic field at a surface of the substrate. The sputtering chamber reduces interference between the magnetron and the magnet array by providing a long throw distance and/or a grounded collimator. The magnet array is preferably a circular ring.