发明授权
- 专利标题： Electroformed sputtering target
- 专利标题（中）： 电铸溅射靶
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申请号： US10431399申请日： 2003-05-06
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公开(公告)号： US07297247B2公开(公告)日： 2007-11-20
- 发明人: Anantha K. Subramani , Anthony Vesci , Scott Dickerson
- 申请人： Anantha K. Subramani , Anthony Vesci , Scott Dickerson
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Janah & Associates
- 主分类号： C25D5/10
- IPC分类号： C25D5/10 ; C25D5/22 ; C25D7/00
摘要：
A method of fabricating a sputtering target for sputter depositing material onto a substrate in a sputtering chamber is described. In one embodiment of the method, a preform having a surface is formed and a layer of sputtering material is electroplated onto the surface of the preform to form the target. The method can be applied to form a sputtering target having a non-planar surface.
公开/授权文献
- US20040222088A1 Electroformed sputtering target 公开/授权日：2004-11-11
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