发明授权
- 专利标题: Semiconductor devices and manufacturing method therefor
- 专利标题(中): 半导体器件及其制造方法
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申请号: US11101577申请日: 2005-04-08
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公开(公告)号: US07298029B2公开(公告)日: 2007-11-20
- 发明人: Mitsuo Usami , Kazutaka Tsuji , Takeshi Saito , Akira Sato , Kenji Sameshima , Kazuo Takaragi , Chizuko Yasunobu
- 申请人: Mitsuo Usami , Kazutaka Tsuji , Takeshi Saito , Akira Sato , Kenji Sameshima , Kazuo Takaragi , Chizuko Yasunobu
- 申请人地址: JP Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Antonelli, Terry, Stout & Kraus, LLP.
- 优先权: JP10-035867 19981217
- 主分类号: H01L23/02
- IPC分类号: H01L23/02 ; H01L29/40
摘要:
A non-contact identification semiconductor device is provided with a semiconductor chip including a receiving circuit that receives an inquiry to the non-contact identification semiconductor device, a memory that stores identification information of multiple bits and a sending circuit that sends the identification information. An antenna coupled to said semiconductor chip receives the identification information from said semiconductor chip and transmits the identification information outside of said non-contact semiconductor. The long side length of the semiconductor chip is not greater than 0.5 mm in plane dimension, and the identification information is stored by a pattern printed by an electron beam.
公开/授权文献
- US20050194591A1 Semiconductor devices and manufacturing method therefor 公开/授权日:2005-09-08
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