发明授权
- 专利标题: Injection molding apparatus and injection molding method
- 专利标题(中): 注塑设备和注塑成型方法
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申请号: US10485387申请日: 2003-06-06
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公开(公告)号: US07303718B2公开(公告)日: 2007-12-04
- 发明人: Shinsuke Kishi , Osamu Matsuura
- 申请人: Shinsuke Kishi , Osamu Matsuura
- 申请人地址: JP Tokyo
- 专利权人: Sony Disc & Digital Solutions Inc.
- 当前专利权人: Sony Disc & Digital Solutions Inc.
- 当前专利权人地址: JP Tokyo
- 代理机构: Rader Fishman & Grauer
- 代理商 Ronald P. Kananen
- 优先权: JP2002-172619 20020613
- 国际申请: PCT/JP03/07192 WO 20030606
- 国际公布: WO03/106135 WO 20031224
- 主分类号: B29C45/20
- IPC分类号: B29C45/20
摘要:
A space 12 is formed at a tip portion of a nozzle 1 so as to decrease a thermal transfer of the nozzle 1. Alternatively, a center portion of one of a semi-spherically protruded surface of the tip portion of the nozzle 1 and a semi-spherically recessed surface of a sprue bush protrudes so that the radius of curvature of one semi-spherical surface is the same as the radius of curvature of the other semi-spherical surface. As a result, since the nozzle 1 and the sprue bush 2 are surface-contacted, heat of the tip portion of the nozzle 1 absorbed to the sprue bush 2 is increased. Thus, the temperature of the tip portion of the nozzle 1 can be lowered easily. After the resin material injected into the molding cavity 11 is cooled, when the sprue portion is removed from the fixed die, a tip portion of a rod-shaped protrusion portion of the sprue can be properly cut.
公开/授权文献
- US20040183231A1 Injection molding apparatus and injection molding method 公开/授权日:2004-09-23
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