Invention Grant
US07304373B2 Power distribution within a folded flex package method and apparatus
有权
折叠式柔性包装方法和装置内的功率分配
- Patent Title: Power distribution within a folded flex package method and apparatus
- Patent Title (中): 折叠式柔性包装方法和装置内的功率分配
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Application No.: US10977908Application Date: 2004-10-28
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Publication No.: US07304373B2Publication Date: 2007-12-04
- Inventor: Brian Taggart , Robert M. Nickerson , Ronald L. Spreitzer
- Applicant: Brian Taggart , Robert M. Nickerson , Ronald L. Spreitzer
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A device includes a folded flex substrate. A memory die is connected to a first side of the folded flex substrate. A logic die is connected to a second side of the folded flex substrate. A trace routing pattern of source voltage signals is identical to a trace routing pattern of collector voltage signals.
Public/Granted literature
- US20060091508A1 Power distribution within a folded flex package method and apparatus Public/Granted day:2006-05-04
Information query
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