Invention Grant
- Patent Title: Interconnect for testing semiconductor components
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Application No.: US11516328Application Date: 2006-09-06
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Publication No.: US07304491B2Publication Date: 2007-12-04
- Inventor: Warren M. Farnworth , Mark Tuttle
- Applicant: Warren M. Farnworth , Mark Tuttle
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agent Stephen A. Gratton
- Main IPC: G01R31/26
- IPC: G01R31/26

Abstract:
An interconnect for testing semiconductor components includes interconnect contacts configured for bonding to, and then separation from component contacts on the components. The interconnect can be utilized with a method that includes the steps of bonding the interconnect to the component to form bonded electrical connections, applying test signals through the bonded electrical connections, and then separating the interconnect from the component. The bonding step can be performed using metallurgical bonding, and the separating step can be performed using solder-wettable and solder non-wettable metal layers on the interconnect or the component. During the separating step the solder-wettable layers are dissolved, reducing adhesion of the bonded electrical connections, and permitting separation of the component and interconnect.
Public/Granted literature
- US20070001700A1 Interconnect for testing semiconductor components Public/Granted day:2007-01-04
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