Invention Grant
- Patent Title: Compliant thermal cap for an electronic device
- Patent Title (中): 符合电子设备的热盖
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Application No.: US10919180Application Date: 2004-08-16
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Publication No.: US07304849B2Publication Date: 2007-12-04
- Inventor: Mark D. Schultz
- Applicant: Mark D. Schultz
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Michael J. Buchenhorner; Casey P. August
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A cooling structure for an electronic device comprises a compliant cap preloaded over the electronic device. The compliant cap comprises a horizontal top surface and at least one vertical support for the surface, the vertical support comprising a compliant portion and wherein the compliant cap comprises a thermally conducting material.
Public/Granted literature
- US20060034060A1 Compliant thermal cap for an electronic device Public/Granted day:2006-02-16
Information query
