发明授权
US07306976B2 Technique for enhancing thermal and mechanical characteristics of an underfill material of a substrate/die assembly
失效
用于增强基底/模具组件的底部填充材料的热和机械特性的技术
- 专利标题： Technique for enhancing thermal and mechanical characteristics of an underfill material of a substrate/die assembly
- 专利标题（中）： 用于增强基底/模具组件的底部填充材料的热和机械特性的技术
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申请号： US11284292申请日： 2005-11-21
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公开(公告)号： US07306976B2公开(公告)日： 2007-12-11
- 发明人: Frank Feustel , Matthias Lehr , Frank Kuechenmeister
- 申请人： Frank Feustel , Matthias Lehr , Frank Kuechenmeister
- 申请人地址： US TX Austin
- 专利权人： Advanced Micro Devices, Inc.
- 当前专利权人： Advanced Micro Devices, Inc.
- 当前专利权人地址： US TX Austin
- 代理机构： Williams, Morgn & Amerson
- 优先权： DE102005020059 20050429
- 主分类号： H01L21/48
- IPC分类号： H01L21/48
摘要：
During the formation of an underfill material provided between a carrier substrate and a semiconductor chip, a common motion of particles contained in the underfill material is initiated towards the semiconductor chip, thereby adjusting the thermal and mechanical behavior of the underfill material. For instance, by applying an external force, such as gravity, a depletion zone with respect to the filler particles may be created in the vicinity of the carrier substrate, while a high particle concentration may be obtained in the vicinity of the semiconductor chip. Hence, thermal and mechanical stress redistribution by means of the underfill material may be enhanced.
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