公开(公告)号：US07306976B2

公开(公告)日：2007-12-11

申请号：US11284292

申请日：2005-11-21

申请人： Frank Feustel ,  Matthias Lehr ,  Frank Kuechenmeister

发明人： Frank Feustel ,  Matthias Lehr ,  Frank Kuechenmeister

IPC分类号： H01L21/48

CPC分类号： H01L23/295 ,  H01L21/563 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1433 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： During the formation of an underfill material provided between a carrier substrate and a semiconductor chip, a common motion of particles contained in the underfill material is initiated towards the semiconductor chip, thereby adjusting the thermal and mechanical behavior of the underfill material. For instance, by applying an external force, such as gravity, a depletion zone with respect to the filler particles may be created in the vicinity of the carrier substrate, while a high particle concentration may be obtained in the vicinity of the semiconductor chip. Hence, thermal and mechanical stress redistribution by means of the underfill material may be enhanced.

摘要翻译： 在载体基板和半导体芯片之间形成的底部填充材料的形成期间，向底部填充材料中包含的颗粒的共同运动开始朝向半导体芯片，由此调整底部填充材料的热和机械性能。 例如，通过施加诸如重力的外力，可能在载体基板附近产生相对于填料颗粒的耗尽区，而在半导体芯片附近可以获得高的颗粒浓度。 因此，可以增强借助于底部填充材料的热和机械应力再分配。