发明授权
- 专利标题： Printed circuit board and method for manufacturing printed circuit board
- 专利标题（中）： 印刷电路板及制造印刷电路板的方法
-
申请号： US11062672申请日： 2005-02-23
-
公开(公告)号： US07307852B2公开(公告)日： 2007-12-11
- 发明人: Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
- 申请人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
- 申请人地址： JP Ogaki-shi
- 专利权人： Ibiden Co., Ltd.
- 当前专利权人： Ibiden Co., Ltd.
- 当前专利权人地址： JP Ogaki-shi
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权： JP11-248311 19990902; JP11-360306 19991220; JP2000-103730 20000405; JP2000-103731 20000405; JP2000-103732 20000405; JP2000-103733 20000405; JP2000-221349 20000721; JP2000-221351 20000721; JP2000-221352 20000721; JP2000-221353 20000721; JP2000-221354 20000721
- 主分类号： H05K7/02
- IPC分类号： H05K7/02 ; H05K7/06 ; H05K7/08 ; H05K7/10
摘要：
Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.
公开/授权文献
信息查询
