Invention Grant
- Patent Title: Stacked module systems and methods
- Patent Title (中): 堆叠模块系统和方法
-
Application No.: US11258438Application Date: 2005-10-25
-
Publication No.: US07310458B2Publication Date: 2007-12-18
- Inventor: James Douglas Wehrly, Jr.
- Applicant: James Douglas Wehrly, Jr.
- Applicant Address: US TX Austin
- Assignee: Staktek Group L.P.
- Current Assignee: Staktek Group L.P.
- Current Assignee Address: US TX Austin
- Agency: Fish & Richardson P.C.
- Main IPC: G02B6/12
- IPC: G02B6/12 ; H05K1/00 ; H01L23/02
Abstract:
The present invention provides methods for constructing stacked circuit modules and precursor assemblies with flexible circuitry. Using the methods of the present invention, a single set of flexible circuitry whether articulated as one or two flex circuits may be employed with CSP devices of a variety of configurations either with or without form standards.
Public/Granted literature
- US20060108572A1 Stacked module systems and methods Public/Granted day:2006-05-25
Information query
