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    Memory expansion and integrated circuit stacking system and method
    2.
    发明授权
    Memory expansion and integrated circuit stacking system and method 有权
    内存扩展和集成电路堆叠系统及方法

    公开(公告)号：US07542304B2

    公开(公告)日：2009-06-02

    申请号：US10804452

    申请日：2004-03-19

    Applicant: Russell Rapport ,  James W. Cady ,  James Wilder ,  David L. Roper ,  James Douglas Wehrly, Jr. ,  Jeff Buchle

    Inventor： Russell Rapport ,  James W. Cady ,  James Wilder ,  David L. Roper ,  James Douglas Wehrly, Jr. ,  Jeff Buchle

    IPC: H01R9/00

    CPC classification number: H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/107 ,  H01L2924/3011 ,  H01L2924/00012

    Abstract: The present invention stacks integrated circuits (ICs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules provided herein. In a preferred embodiment in accordance with the invention, a form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In a preferred embodiment, the form standard will be devised of heat transference material such as copper to improve thermal performance. In a preferred embodiment of the memory addressing system, a high speed switching system selects a data line associated with each level of a stacked module to reduce the loading effect upon data signals in memory access.

    Abstract translation: 本发明将集成电路（IC）堆叠成节省PWB或其他板表面积的模块。 在另一方面，本发明提供了一种较低电容存储器扩展寻址系统和方法，并且优选地具有本文提供的CSP堆叠模块。 在根据本发明的优选实施例中，形式标准提供了一种物理形式，其允许在广泛的CSP封装系列中发现的许多变化的封装尺寸在使用标准连接柔性电路设计时被有利地使用。 在优选实施例中，将设计形式标准，以便传热材料例如铜，以改善热性能。 在存储器寻址系统的优选实施例中，高速交换系统选择与堆叠模块的每个级别相关联的数据线，以减少对存储器访问中的数据信号的负载影响。

    High capacity thin module system
    3.
    发明授权
    High capacity thin module system 有权
    大容量薄模块系统

    公开(公告)号：US07443023B2

    公开(公告)日：2008-10-28

    申请号：US11231418

    申请日：2005-09-21

    Applicant: James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    Inventor： James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    IPC: H01L23/34 ,  H01L21/00 ,  H05K7/20

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

    Abstract translation: 灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。 衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。 其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。 来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

    Contact member stacking system and method
    7.
    发明授权
    Contact member stacking system and method 有权
    接触件堆垛系统及方法

    公开(公告)号：US06893899B2

    公开(公告)日：2005-05-17

    申请号：US10814531

    申请日：2004-03-31

    Applicant: James Douglas Wehrly, Jr.

    Inventor： James Douglas Wehrly, Jr.

    IPC: H01L25/10 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/02

    CPC classification number: H01L25/105 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A system and method for selectively stacking and interconnecting individual integrated circuit devices to create a high-density integrated circuit module. In a preferred embodiment, conventional thin small outline packaged (TSOP) memory circuits are vertically stacked one above the other. The constituent IC elements act in concert to provide an assembly of memory capacity approximately equal to the sum of the capacities of the ICs that constitute the assembly. The IC elements of the stack are electrically connected through individual contact members that connect corresponding leads of IC elements positioned adjacently in the stack. In a preferred embodiment, the contact members are composed of lead frame material. Methods for creating stacked integrated circuit modules are provided that provide reasonable cost, mass production techniques to produce modules. In a preferred method, a carrier frame of lead frame material is configured to present an opening into which opening project plural lead-like contact members that correspond to the leads of an IC element. The contact members contact the leads of the lower IC element of the stack while the leads of the upper IC of the assembly contact the upper surfaces of the contact members. The stack is assembled using typical surface mount equipment and, after assembly, the carrier portion of the frame is removed to leave the plurality of contact members in place between selected leads.

    Abstract translation: 一种用于选择性堆叠和互连各个集成电路器件以创建高密度集成电路模块的系统和方法。 在优选实施例中，传统的薄小外形封装（TSOP）存储器电路一个在另一个之上垂直堆叠。 组成的IC元件一致地提供大约等于构成组件的IC的容量之和的存储器容量的组合。 堆叠的IC元件通过单独的接触构件电连接，该接触构件连接相邻于IC堆叠的IC元件的相应引线。 在优选实施例中，接触构件由引线框架材料构成。 提供了制造堆叠集成电路模块的方法，其提供合理的成本，批量生产技术来生产模块。 在优选的方法中，引线框架材料的载体框架构造成具有开口，该开口突出了与IC元件的引线相对应的多个引线状接触构件。 接触构件接触堆叠的下部IC元件的引线，而组件的上部IC的引线接触接触构件的上表面。 堆叠使用典型的表面贴装设备组装，并且在组装之后，移除框架的托架部分以使多个接触构件在选定的引线之间就位。

    Circuit module with thermal casing systems
    9.
    发明授权
    Circuit module with thermal casing systems 失效
    具有热套管系统的电路模块

    公开(公告)号：US07737549B2

    公开(公告)日：2010-06-15

    申请号：US12263060

    申请日：2008-10-31

    Applicant: James Douglas Wehrly, Jr. ,  James Wilder ,  Mark Wolfe ,  Paul Goodwin

    Inventor： James Douglas Wehrly, Jr. ,  James Wilder ,  Mark Wolfe ,  Paul Goodwin

    IPC: H01L23/34 ,  H05K7/20 ,  H01L21/00

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

    Abstract translation: 灵活的电路采用集成电路（IC），并且触点沿柔性电路分布，以提供与应用环境的连接。 柔性电路围绕刚性衬底设置，将IC放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或多层集成电路。 衬底优选地由导热材料设计，并且一个或多个热扩散器与至少一些IC热接触。 可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。 在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的放大表面。

    Heat sink for a high capacity thin module system
    10.
    发明授权
    Heat sink for a high capacity thin module system 有权
    散热器用于高容量薄模块系统

    公开(公告)号：US07626259B2

    公开(公告)日：2009-12-01

    申请号：US12258189

    申请日：2008-10-24

    Applicant: James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    Inventor： James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    IPC: H01L23/34 ,  H01L21/00 ,  H05K7/20

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

    Abstract translation: 灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。 衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。 其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。 来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

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