Invention Grant
- Patent Title: Shredder apparatus and shredding method
- Patent Title (中): 粉碎设备和粉碎方法
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Application No.: US10647235Application Date: 2003-08-26
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Publication No.: US07311277B2Publication Date: 2007-12-25
- Inventor: Ryoji Watanabe , Akihiko Takada , Masayoshi Sakakibara , Hajime Kishimoto , Yasuo Horino , Toshiyuki Yano , Yasuhiro Matsuo
- Applicant: Ryoji Watanabe , Akihiko Takada , Masayoshi Sakakibara , Hajime Kishimoto , Yasuo Horino , Toshiyuki Yano , Yasuhiro Matsuo
- Applicant Address: JP Tokyo
- Assignee: Fuji Xerox, Co., Ltd.
- Current Assignee: Fuji Xerox, Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2002-248789 20020828; JP2003-169622 20030613
- Main IPC: B02B5/02
- IPC: B02B5/02 ; B02C1/10 ; B02C9/04 ; B02C19/10 ; B03B7/00

Abstract:
When a printing paper to which an IC chip storing secret information is attached is discarded, a shredder applied voltage to the IC chip by a discharging unit to destroy the IC chip and to make it impossible to read the secret information therefrom. Thereafter, a shredding cutter shreds the printing paper and the shred printing paper is discarded.
Public/Granted literature
- US20040069883A1 Shredder apparatus and shredding method Public/Granted day:2004-04-15
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