发明授权
- 专利标题: Heat treatment apparatus
- 专利标题(中): 热处理设备
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申请号: US10528704申请日: 2003-08-29
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公开(公告)号: US07311520B2公开(公告)日: 2007-12-25
- 发明人: Takanori Saito , Kenichi Yamaga , Ken Nakao
- 申请人: Takanori Saito , Kenichi Yamaga , Ken Nakao
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 代理机构: Smith, Gambrell & Russell, LLP
- 优先权: JP2002-278046 20020924
- 国际申请: PCT/JP03/11100 WO 20030829
- 国际公布: WO2004/030061 WO 20040408
- 主分类号: F27D11/00
- IPC分类号: F27D11/00
摘要:
The present invention is a thermal processing unit including: a heating-furnace body whose upper end has an opening; a reaction tube consisting of a single tube contained in the heating-furnace body; a gas-discharging-unit connecting portion formed at an upper portion of the reaction tube, the gas-discharging-unit connecting portion having a narrow diameter; a substrate-to-be-processed supporting member for supporting a substrate to be processed, contained in the heating-furnace body; and a heating unit for heating the substrate to be processed supported by the substrate-to-be-processed supporting member. The heating unit has: a first heating portion arranged around the reaction tube, a second heating portion arranged around the gas-discharging-unit connecting portion, a third heating portion arranged around an upper portion of the reaction tube, a fourth heating portion arranged around a lower portion of the reaction tube, and a fifth heating portion arranged under the substrate-to-be-processed supporting member.
公开/授权文献
- US20060021582A1 Heat treatment apparatus 公开/授权日:2006-02-02