Invention Grant
- Patent Title: System for ultraviolet atmospheric seed layer remediation
- Patent Title (中): 紫外线大气种子层修复系统
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Application No.: US11334181Application Date: 2006-01-17
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Publication No.: US07312151B2Publication Date: 2007-12-25
- Inventor: Aaron Frank , David Gonzalez , John DeGenova , Srinavas Raghavan , Deepak A. Ramappa
- Applicant: Aaron Frank , David Gonzalez , John DeGenova , Srinavas Raghavan , Deepak A. Ramappa
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; W. James Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
The present invention provides a system for removing organic contaminants (216) from a copper seed layer that has been deposited on a semiconductor substrate (206). The present invention provides a housing (204) to enclose the semiconductor substrate within. An ultraviolet radiation source (210) is disposed within the housing. A treatment medium (208) is also provided within the housing. The semiconductor substrate is enclosed within the housing and exposed to the treatment medium. The ultraviolet radiation source exposes the semiconductor substrate to ultraviolet radiation, desorbing the contaminants from the seed layer.
Public/Granted literature
- US20060113499A1 System for ultraviolet atmospheric seed layer remediation Public/Granted day:2006-06-01
Information query
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