公开(公告)号：US20060113499A1

公开(公告)日：2006-06-01

申请号：US11334181

申请日：2006-01-17

申请人： Aaron Frank ,  David Gonzalez ,  John DeGenova ,  Srinivas Raghavan ,  Deepak Ramappa

发明人： Aaron Frank ,  David Gonzalez ,  John DeGenova ,  Srinivas Raghavan ,  Deepak Ramappa

IPC分类号： G01J3/10 ,  A61N5/06

CPC分类号： H01L21/76856 ,  B08B7/0057 ,  C25D5/34 ,  H01L21/321 ,  H01L21/67028 ,  H01L21/67115 ,  H01L21/76862 ,  H01L21/76873

摘要： The present invention provides a system for removing organic contaminants (216) from a copper seed layer that has been deposited on a semiconductor substrate (206). The present invention provides a housing (204) to enclose the semiconductor substrate within. An ultraviolet radiation source (210) is disposed within the housing. A treatment medium (208) is also provided within the housing. The semiconductor substrate is enclosed within the housing and exposed to the treatment medium. The ultraviolet radiation source exposes the semiconductor substrate to ultraviolet radiation, desorbing the contaminants from the seed layer.

公开(公告)号：US07312151B2

公开(公告)日：2007-12-25

申请号：US11334181

申请日：2006-01-17

申请人： Aaron Frank ,  David Gonzalez ,  John DeGenova ,  Srinavas Raghavan ,  Deepak A. Ramappa

发明人： Aaron Frank ,  David Gonzalez ,  John DeGenova ,  Srinavas Raghavan ,  Deepak A. Ramappa

IPC分类号： H01L21/44

CPC分类号： H01L21/76856 ,  B08B7/0057 ,  C25D5/34 ,  H01L21/321 ,  H01L21/67028 ,  H01L21/67115 ,  H01L21/76862 ,  H01L21/76873

摘要： The present invention provides a system for removing organic contaminants (216) from a copper seed layer that has been deposited on a semiconductor substrate (206). The present invention provides a housing (204) to enclose the semiconductor substrate within. An ultraviolet radiation source (210) is disposed within the housing. A treatment medium (208) is also provided within the housing. The semiconductor substrate is enclosed within the housing and exposed to the treatment medium. The ultraviolet radiation source exposes the semiconductor substrate to ultraviolet radiation, desorbing the contaminants from the seed layer.

摘要翻译： 本发明提供了一种从已沉积在半导体衬底（206）上的铜籽晶层去除有机污染物（216）的系统。 本发明提供一种将半导体衬底包围的壳体（204）。 紫外线辐射源（210）设置在壳体内。 处理介质（208）也设置在壳体内。 将半导体衬底封装在壳体内并暴露于处理介质。 紫外线辐射源将半​​导体衬底暴露于紫外线辐射，从种子层解吸污染物。

公开(公告)号：US20050042886A1

公开(公告)日：2005-02-24

申请号：US10645679

申请日：2003-08-21

申请人： Aaron Frank ,  David Gonzalez ,  John DeGenova ,  Srinivas Raghavan ,  Deepak Ramappa

发明人： Aaron Frank ,  David Gonzalez ,  John DeGenova ,  Srinivas Raghavan ,  Deepak Ramappa

IPC分类号： H01L21/28 ,  B08B7/00 ,  C25D5/34 ,  C25D7/12 ,  H01L21/00 ,  H01L21/288 ,  H01L21/304 ,  H01L21/321 ,  H01L21/768 ,  H01L21/31

CPC分类号： H01L21/76856 ,  B08B7/0057 ,  C25D5/34 ,  H01L21/321 ,  H01L21/67028 ,  H01L21/67115 ,  H01L21/76862 ,  H01L21/76873

摘要： The present invention provides a system for removing organic contaminants (216) from a copper seed layer that has been deposited on a semiconductor substrate (206). The present invention provides a housing (204) to enclose the semiconductor substrate within. An ultraviolet radiation source (210) is disposed within the housing. A treatment medium (208) is also provided within the housing. The semiconductor substrate is enclosed within the housing and exposed to the treatment medium. The ultraviolet radiation source exposes the semiconductor substrate to ultraviolet radiation, desorbing the contaminants from the seed layer.

摘要翻译： 本发明提供了一种从已沉积在半导体衬底（206）上的铜籽晶层去除有机污染物（216）的系统。 本发明提供一种将半导体衬底包围的壳体（204）。 紫外线辐射源（210）设置在壳体内。 处理介质（208）也设置在壳体内。 将半导体衬底封装在壳体内并暴露于处理介质。 紫外线辐射源将半​​导体衬底暴露于紫外线辐射，从种子层解吸污染物。

公开(公告)号：US07015568B2

公开(公告)日：2006-03-21

申请号：US10645679

申请日：2003-08-21

申请人： Aaron Frank ,  David Gonzalez ,  John DeGenova ,  Srinavas Raghavan ,  Deepak A. Ramappa

发明人： Aaron Frank ,  David Gonzalez ,  John DeGenova ,  Srinavas Raghavan ,  Deepak A. Ramappa

IPC分类号： H01L23/552

CPC分类号： H01L21/76856 ,  B08B7/0057 ,  C25D5/34 ,  H01L21/321 ,  H01L21/67028 ,  H01L21/67115 ,  H01L21/76862 ,  H01L21/76873

摘要： The present invention provides a system for removing organic contaminants (216) from a copper seed layer that has been deposited on a semiconductor substrate (206). The present invention provides a housing (204) to enclose the semiconductor substrate within. An ultraviolet radiation source (210) is disposed within the housing. A treatment medium (208) is also provided within the housing. The semiconductor substrate is enclosed within the housing and exposed to the treatment medium. The ultraviolet radiation source exposes the semiconductor substrate to ultraviolet radiation, desorbing the contaminants from the seed layer.

摘要翻译： 本发明提供了一种从已沉积在半导体衬底（206）上的铜籽晶层去除有机污染物（216）的系统。 本发明提供一种将半导体衬底包围的壳体（204）。 紫外线辐射源（210）设置在壳体内。 处理介质（208）也设置在壳体内。 将半导体衬底封装在壳体内并暴露于处理介质。 紫外线辐射源将半​​导体衬底暴露于紫外线辐射，从种子层解吸污染物。