Invention Grant
- Patent Title: Surface position measuring method, exposure apparatus, and device manufacturing method
- Patent Title (中): 表面位置测量方法,曝光装置和装置制造方法
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Application No.: US11489896Application Date: 2006-07-20
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Publication No.: US07313873B2Publication Date: 2008-01-01
- Inventor: Satoru Oishi , Hideki Ina
- Applicant: Satoru Oishi , Hideki Ina
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Cowan, Liebowitz & Latman, P.C.
- Priority: JP2005/210775 20050721
- Main IPC: G01B11/00
- IPC: G01B11/00

Abstract:
A surface position measuring method wherein measurement light is obliquely projected onto a substrate surface and on the basis of a position of the detected measurement light and a predetected offset, the position of the substrate surface with respect to a direction of an optical axis of the projection optical system is measured, memorizing a first position of a point on the substrate while using a reference mark provided on a substrate stage, measuring the position of the measurement light as a first measurement position; rotating the substrate by 180 deg. in a plane perpendicular to the optical axis; memorizing a second position of the measurement point on the rotated substrate with reference to the reference mark; measuring the position of the measurement light as a second measurement position; and detecting of the offset at the measurement point on the basis of the first and second measurement position.
Public/Granted literature
- US20070017110A1 Surface position measuring method, exposure apparatus, and device manufacturing method Public/Granted day:2007-01-25
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