发明授权
- 专利标题： Fingerprint sensor package
- 专利标题（中）： 指纹传感器包装
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申请号： US10960990申请日： 2004-10-12
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公开(公告)号： US07315070B2公开(公告)日： 2008-01-01
- 发明人: Akira Okada , Mitsuru Sato , Hideo Sato
- 申请人： Akira Okada , Mitsuru Sato , Hideo Sato
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP.
- 优先权： JP2004-163470 20040601
- 主分类号： H01L29/84
- IPC分类号： H01L29/84 ; G06K9/00
摘要：
A fingerprint sensor package includes an LSI chip for reading a fingerprint, a substrate having an external connection terminal and to which the LSI chip is fixed, and a chip fixing mechanism for fixing the LSI chip in a state where the LSI chip is deformed so as to form a curved surface, provided between the LSI chip and the substrate.
公开/授权文献
- US20050263836A1 Fingerprint sensor package 公开/授权日：2005-12-01
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