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    Semiconductor device for fingerprint recognition
    3.
    发明授权
    Semiconductor device for fingerprint recognition 有权
    用于指纹识别的半导体器件

    公开(公告)号：US07989938B2

    公开(公告)日：2011-08-02

    申请号：US12382532

    申请日：2009-03-18

    申请人： Akira Okada ,  Mitsuru Sato

    发明人： Akira Okada ,  Mitsuru Sato

    IPC分类号： H01L238/48

    CPC分类号： G06K9/0002 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/05599

    摘要： A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reliability.The semiconductor device includes the semiconductor chip having a sensor unit that performs fingerprint recognition, and a substrate having an opening formed in the position corresponding to the sensor unit. The semiconductor chip is flip chip bonded to the substrate such that the sensor unit corresponds to the opening, and except for the formed position of the opening, an under-fill material is provided between the semiconductor chip and the substrate.

    摘要翻译： 公开了对静电容量原理执行指纹识别的半导体器件。 跨越半导体芯片的指纹识别区域的手指提供了正确的指纹识别操作，并提高了可靠性。 半导体器件包括具有执行指纹识别的传感器单元的半导体芯片和具有形成在与传感器单元对应的位置的开口的基板。 将半导体芯片倒装贴合到基板上，使得传感器单元对应于开口，除了开口的形成位置之外，在半导体芯片和基板之间设置有未填充材料。

    Semiconductor device for fingerprint recognition
    5.
    发明申请
    Semiconductor device for fingerprint recognition 有权
    用于指纹识别的半导体器件

    公开(公告)号：US20090184408A1

    公开(公告)日：2009-07-23

    申请号：US12382532

    申请日：2009-03-18

    申请人： Akira Okada ,  Mitsuru Sato

    发明人： Akira Okada ,  Mitsuru Sato

    IPC分类号： H01L23/00 ,  H01L23/48

    CPC分类号： G06K9/0002 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/05599

    摘要： A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reliability.The semiconductor device includes the semiconductor chip having a sensor unit that performs fingerprint recognition, and a substrate having an opening formed in the position corresponding to the sensor unit. The semiconductor chip is flip chip bonded to the substrate such that the sensor unit corresponds to the opening, and except for the formed position of the opening, an under-fill material is provided between the semiconductor chip and the substrate.

    摘要翻译： 公开了对静电容量原理执行指纹识别的半导体器件。 跨越半导体芯片的指纹识别区域的手指提供了正确的指纹识别操作，并提高了可靠性。 半导体器件包括具有执行指纹识别的传感器单元的半导体芯片和具有形成在与传感器单元对应的位置的开口的基板。 将半导体芯片倒装贴合到基板上，使得传感器单元对应于开口，除了开口的形成位置之外，在半导体芯片和基板之间设置有未填充材料。

    Method for manufacturing semiconductor device and semiconductor device
    6.
    发明授权
    Method for manufacturing semiconductor device and semiconductor device 有权
    半导体器件和半导体器件的制造方法

    公开(公告)号：US09076820B2

    公开(公告)日：2015-07-07

    申请号：US13600373

    申请日：2012-08-31

    申请人： Soichiro Kitazaki ,  Masaru Kidoh ,  Mitsuru Sato ,  Ryota Katsumata ,  Tadashi Iguchi

    发明人： Soichiro Kitazaki ,  Masaru Kidoh ,  Mitsuru Sato ,  Ryota Katsumata ,  Tadashi Iguchi

    IPC分类号： H01L27/115 ,  H01L29/66 ,  H01L29/78

    CPC分类号： H01L29/66666 ,  H01L27/11565 ,  H01L27/11582 ,  H01L29/7827

    摘要： According to one embodiment, a method for manufacturing a semiconductor device includes forming a plurality of insulating isolation sections provided so as to extend in a first direction, isolate the stacked body in a second direction, and have a projection projecting from the stacked body. Each insulating isolation section has a side wall including recessed sections and projected sections repeated along the first direction. The method includes forming a sidewall film on a side wall of the projection of the insulating isolation section, and forming a plurality of first holes surrounded by the sidewall film and isolated by the sidewall film in the first direction, between the plurality of insulating isolation sections. The method includes forming a second hole in the stacked body provided under the first hole by etching with the insulating isolation section and the sidewall film used as a mask.

    摘要翻译： 根据一个实施例，一种用于制造半导体器件的方法包括形成多个绝缘隔离部分，其被设置为沿第一方向延伸，使堆叠体沿第二方向隔离，并具有从堆叠体突出的突出部。 每个绝缘隔离部分具有侧壁，该侧壁包括沿着第一方向重复的凹陷部分和突出部分。 该方法包括在绝缘隔离部分的突起的侧壁上形成侧壁膜，并且在多个绝缘隔离部分之间形成由侧壁膜围绕并由第一方向隔离的多个第一孔 。 该方法包括通过用绝缘隔离部分和用作掩模的侧壁膜进行蚀刻，在设置在第一孔下方的层叠体中形成第二孔。

    Input/output connection device, information processing device, and method for inspecting input/output device
    7.
    发明授权
    Input/output connection device, information processing device, and method for inspecting input/output device 有权
    输入/输出连接装置，信息处理装置和检测输入/输出装置的方法

    公开(公告)号：US08867369B2

    公开(公告)日：2014-10-21

    申请号：US13047137

    申请日：2011-03-14

    申请人： Mitsuru Sato

    发明人： Mitsuru Sato

    IPC分类号： H04L12/26 ,  G06F13/42 ,  G06F13/20 ,  G06F3/00

    CPC分类号： G06F13/4295

    摘要： An input/output connection device includes a generating section which generates an inspection packet that has a tag that uniquely identifies the packet, a transmitting section which transmits the inspection packet to the input/output device, a receiving section which receives a packet, a first determining section which determines, on the basis of a tag of the packet received by the receiving section, whether or not the received packet is a packet transmitted in response to the inspection packet transmitted by the transmitting section, and a second determining section which analyzes the received packet and determines whether or not the input/output device is normal when the first determining section determines that the received packet is the packet transmitted in response to the inspection packet.

    摘要翻译： 一种输入/输出连接装置，包括：生成部，其生成具有唯一地识别分组的标签的检查分组;将检查分组发送到输入/输出装置的发送部;接收分组的接收部; 确定部，其基于由所述接收部接收到的分组的标签，确定所接收的分组是否是响应于由所述发送部发送的所述检查分组而发送的分组;以及第二确定部， 并且当第一确定部确定接收到的分组是响应于检查分组而发送的分组时，确定输入/输出设备是否正常。

    Solid-state imaging device
    8.
    发明授权
    Solid-state imaging device 有权
    固态成像装置

    公开(公告)号：US08598640B2

    公开(公告)日：2013-12-03

    申请号：US13211362

    申请日：2011-08-17

    申请人： Yoshiaki Kitano ,  Hideshi Abe ,  Jun Kuroiwa ,  Kiyoshi Hirata ,  Hiroaki Ohki ,  Nobuhiro Karasawa ,  Ritsuo Takizawa ,  Mitsuru Yamashita ,  Mitsuru Sato ,  Katsunori Kokubun

    发明人： Yoshiaki Kitano ,  Hideshi Abe ,  Jun Kuroiwa ,  Kiyoshi Hirata ,  Hiroaki Ohki ,  Nobuhiro Karasawa ,  Ritsuo Takizawa ,  Mitsuru Yamashita ,  Mitsuru Sato ,  Katsunori Kokubun

    IPC分类号： H01L31/113 ,  H01L27/146

    CPC分类号： H01L27/14601 ,  H01L27/14689 ,  H01L27/14806 ,  H04N5/335

    摘要： A solid-state imaging device with a structure such that an electrode for reading a signal charge is provided on one side of a light-receiving sensor portion constituting a pixel; a predetermined voltage signal V is applied to a light-shielding film formed to cover an image pickup area except the light-receiving sensor portion; a second-conductivity-type semiconductor area is formed in the center on the surface of a first-conductivity-type semiconductor area constituting a photo-electric conversion area of the light-receiving sensor portion; and areas containing a lower impurity concentration than that of the second-conductivity-type semiconductor area is formed on the surface of the first-conductivity-type semiconductor area at the end on the side of the electrode and at the opposite end on the side of a pixel-separation area.

    摘要翻译： 具有这样一种结构的固态成像装置，该结构使得用于读取信号电荷的电极设置在构成像素的光接收传感器部分的一侧; 将预定的电压信号V施加到形成为覆盖除了光接收传感器部分之外的图像拾取区域的遮光膜; 第二导电型半导体区域形成在构成光接收传感器部分的光电转换区域的第一导电型半导体区域的表面上的中心; 并且在第一导电型半导体区域的电极侧的端部的表面上形成比第二导电型半导体区域的杂质浓度低的区域， 像素分离区域。

    Liquid droplet ejection head and liquid droplet ejection apparatus
    10.
    发明授权
    Liquid droplet ejection head and liquid droplet ejection apparatus 有权
    液滴喷射头和液滴喷射装置

    公开(公告)号：US08517519B2

    公开(公告)日：2013-08-27

    申请号：US13104268

    申请日：2011-05-10

    申请人： Mitsuru Sato ,  Takatoshi Yamamoto

    发明人： Mitsuru Sato ,  Takatoshi Yamamoto

    IPC分类号： B41J2/045

    CPC分类号： B41J2/1433 ,  B41J2/14274 ,  B41J2/1612 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1645 ,  B41J2/1646

    摘要： An ink jet type recording head includes a substrate, a nozzle plate having nozzles, and a sealing sheet, and the substrate and the nozzle plate are bonded to each other through a bonding film, and the substrate and the sealing sheet are bonded to each other through a bonding film. These bonding films are each obtained by drying and/or curing a liquid material containing an epoxy-modified silicone material. Further, by applying energy to each bonding film, the surface thereof is activated, and therefore, each bonding film exhibits a bonding property. By this bonding property, the substrate is bonded to the nozzle plate and to the sealing sheet.

    摘要翻译： 喷墨型记录头包括基板，具有喷嘴的喷嘴板和密封片，并且基板和喷嘴板通过接合膜彼此接合，并且基板和密封片彼此接合 通过粘合膜。 这些接合膜各自通过干燥和/或固化含有环氧改性的有机硅材料的液体材料而获得。 此外，通过向每个接合膜施加能量，其表面被激活，因此每个接合膜都具有接合性。 通过这种粘合特性，将基板粘合到喷嘴板和密封片上。