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发明授权
US07326983B2 Selective silicon-on-insulator isolation structure and method 有权
选择性绝缘体上硅绝缘体隔离结构及方法

Selective silicon-on-insulator isolation structure and method
摘要：
A first aspect of the present invention is a method of forming an isolation structure including: (a) providing a semiconductor substrate; (b) forming a buried N-doped region in the substrate; (c) forming a vertical trench in the substrate, the trench extending into the N-doped region; (d) removing the N-doped region to form a lateral trench communicating with and extending perpendicular to the vertical trench; and (e) at least partially filling the lateral trench and filling the vertical trench with one or more insulating materials.
摘要（中）：

本发明的第一方面是一种形成隔离结构的方法，包括：（a）提供半导体衬底; （b）在衬底中形成掩埋的N掺杂区域; （c）在所述衬底中形成垂直沟槽，所述沟槽延伸到所述N掺杂区域中; （d）去除所述N掺杂区域以形成与所述垂直沟槽连通并垂直于所述垂直沟槽延伸的横向沟槽; 和（e）至少部分地填充横向沟槽并用一种或多种绝缘材料填充垂直沟槽。

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