Abstract:
Techniques are disclosed for providing cross-tier management in a multi-tier computing system architecture. For example, a method for managing a computing system, wherein the computing system includes a first tier and at least a second tier, wherein the first tier and the second tier are configured to respond to a request received by the computing system, includes the steps of monitoring performance of the second tier from the first tier, and sending one or more management commands from the first tier to the second tier based on the monitored performance. In one embodiment, the first tier may be an application server tier of the computing system, and the second tier may be a database server tier of the computing system.
Abstract:
In one embodiment, functional system elements are added to an autonomic manager to enable automatic online sample interval selection. In another embodiment, a method for determining the sample interval by continually characterizing the system workload behavior includes monitoring the system data and analyzing the degree to which the workload is stationary. This makes the online optimization method less sensitive to system noise and capable of being adapted to handle different workloads. The effectiveness of the autonomic optimizer is thereby improved, making it easier to manage a wide range of systems.
Abstract:
Techniques for managing a plurality of configuration items in an information repository are provided. Lifecycle state transitions of the plurality of configuration items are regulated in accordance with one or more lifecycle state transition diagrams and, when a life cycle state transition involves a protected life cycle state, one or more request for change identifiers.
Abstract:
Techniques are disclosed for providing cross-tier management in a multi-tier computing system architecture. For example, a method for managing a computing system, wherein the computing system includes a first tier and at least a second tier, wherein the first tier and the second tier are configured to respond to a request received by the computing system, includes the steps of monitoring performance of the second tier from the first tier, and sending one or more management commands from the first tier to the second tier based on the monitored performance. In one embodiment, the first tier may be an application server tier of the computing system, and the second tier may be a database server tier of the computing system.
Abstract:
Embodiments of the present invention address deficiencies of the art in respect to server provisioning in a heterogeneous computing environment and provide a method, system and computer program product for secure and verified distributed orchestration and provisioning. In one embodiment of the invention, a server provisioning method can be provided. The server provisioning method can include establishing grouping criteria, grouping different target computing nodes into different groups of target computing nodes according to the established grouping criteria, server provisioning a root node in each of the different groups of target computing nodes, and relying upon the root node in each of the different groups to peer-to-peer server provision remaining nodes in each of the different groups.
Abstract:
Methods and systems are provided for tuning memory allocated among a plurality of applications in a data processing system. In one implementation, the method includes generating memory benefit data for the plurality of applications, comparing the generated memory benefit data associated with each of the plurality of applications, and dynamically reallocating memory from one or more of the plurality of applications to one or more other of the plurality of applications based on the comparison. A method and system is also provided for tuning memory allocated among a plurality of individual memory consumers for a given application.
Abstract:
A method to form a closed air gap interconnect structure is described. A starting structure made of regions of a permanent support dielectric under the interconnect lines and surrounding interconnect vias with one or more sacrificial dielectrics present in the remaining portions of the interconnect structure, is capped with a dielectric barrier which is perforated using a stencil with a regular array of holes. The sacrificial dielectrics are then extracted through the holes in the dielectric barrier layer such that the interconnect lines are substantially surrounded by air except for the regions of the support dielectric under the lines. The holes in the cap layer are closed off by depositing a second barrier dielectric so that a closed air gap is formed. Several embodiments of this method and the resulting structures are described.
Abstract:
The present invention provides a complementary metal oxide semiconductor integration process whereby a plurality of silicided metal gates are fabricated atop a gate dielectric. Each silicided metal gate that is formed using the integration scheme of the present invention has the same silicide metal phase and substantially the same height, regardless of the dimension of the silicide metal gate. The present invention also provides various methods of forming a CMOS structure having silicided contacts in which the polySi gate heights are substantially the same across the entire surface of a semiconductor structure.
Abstract:
A method and structure for controlling a manufacturing tool includes measuring different manufacturing parameters of the tool, transforming a plurality of time series of the manufacturing parameters into intermediate variables based on restrictions and historical reference statistics, generating a surrogate variable based on the intermediate variables, if the surrogate variable exceeds a predetermined limit, identifying a first intermediate variable, of the intermediate variables, that caused the surrogate variable to exceed the predetermined limit and identifying a first manufacturing parameter associated with the first intermediate variable, and inhibiting further operation of the tool until the first manufacturing parameter has been modified to bring the surrogate value within the predetermined limit.
Abstract:
A method of forming a notched gate structure having substantially vertical sidewalls and a sub-0.05 &mgr;m electrical critical dimension is provided. The method includes forming a conductive layer on an insulating layer; forming a mask on the conductive layer so as to at least protect a portion of the conductive layer; anisotropically etching the conductive layer not protected by the mask so as to thin the conductive layer to a predetermined thickness and to form a conductive feature underlying the mask, the conductive feature having substantially vertical sidewalls; forming a passivating layer at least on the substantially vertical sidewalls; and isotropically etching remaining conductive layer not protected by the mask to remove the predetermined thickness thereby exposing a lower portion of said conductive feature not containing the passivating layer, while simultaneously removing notched regions in the lower portion of the conductive feature.