发明授权
- 专利标题: Method of manufacturing a semiconductor device
- 专利标题(中): 制造半导体器件的方法
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申请号: US10607542申请日: 2003-06-27
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公开(公告)号: US07329594B2公开(公告)日: 2008-02-12
- 发明人: Akihisa Shimomura , Osamu Nakamura , Tatsuya Arao , Hidekazu Miyairi , Atsuo Isobe , Tamae Takano , Kouki Inoue
- 申请人: Akihisa Shimomura , Osamu Nakamura , Tatsuya Arao , Hidekazu Miyairi , Atsuo Isobe , Tamae Takano , Kouki Inoue
- 申请人地址: JP Kanagawa-ken
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Kanagawa-ken
- 代理机构: Robinson Intellectual Property Law Office P.C.
- 代理商 Eric J. Robinson
- 优先权: JP2002-191493 20020628
- 主分类号: H01L21/425
- IPC分类号: H01L21/425
摘要:
An impurity of one conductivity type is ionized and accelerated by electric field before being implanted into a semiconductor layer to form a high concentration impurity region near its surface. Then the semiconductor layer is irradiated with continuous wave laser light for melting and crystallization or recrystallization, through which a region where the concentration of the impurity is constant is formed in the semiconductor layer. The continuous wave laser light irradiation may bring the semiconductor layer to the crystalline phase from the amorphous phase as long as the impurity element is re-distributed. The impurity is segregated through this process to newly create a high concentration region. However, this region is removed and no problem arises.
公开/授权文献
- US20040038465A1 Method of manufacturing a semiconductor device 公开/授权日:2004-02-26
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