发明授权
- 专利标题： Semiconductor chip and tab package having the same
- 专利标题（中）： 具有相同的半导体芯片和接头封装
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申请号： US11261260申请日： 2005-10-28
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公开(公告)号： US07329597B2公开(公告)日： 2008-02-12
- 发明人: Ye-Chung Chung , Dong-Han Kim , Sa-Yoon Kang
- 申请人： Ye-Chung Chung , Dong-Han Kim , Sa-Yoon Kang
- 申请人地址： KR Suwon-si, Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si, Gyeonggi-do
- 代理机构： Marger Johnson & McCollom, P.C.
- 优先权： KR10-2004-0098010 20041126
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L23/48
摘要：
A semiconductor chip, having an active surface including a peripheral area and a central area, presents a connection area formed on a portion of the peripheral area. The semiconductor chip includes output pads formed in the peripheral area of the active surface and input pads formed in the central area of the active surface. The input pads may be connected to wiring patterns of a TAB tape passing over the connection area.
公开/授权文献
- US20060113648A1 Semiconductor chip and tab package having the same 公开/授权日：2006-06-01
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