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    Low-cost flexible film package module and method of manufacturing the same
    2.
    发明授权
    Low-cost flexible film package module and method of manufacturing the same 有权
    低成本的柔性薄膜封装模块及其制造方法

    公开(公告)号：US07109575B2

    公开(公告)日：2006-09-19

    申请号：US10862337

    申请日：2004-06-08

    申请人： Sa-Yoon Kang ,  Dong-Han Kim ,  Ye-Chung Chung

    发明人： Sa-Yoon Kang ,  Dong-Han Kim ,  Ye-Chung Chung

    IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/12 ,  H01L23/52 ,  H01L29/40

    CPC分类号： G02F1/13452 ,  H01L23/5387 ,  H01L2224/16 ,  H01L2924/07811 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/068 ,  H05K2201/10681 ,  H01L2924/00

    摘要： Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package module for specific applications. The lower-cost flexible film package module includes a tape film that combines both a first insulating substrate, typically formed from a higher-cost polyimide material, and a second insulating substrate, typically formed from an insulating material or materials that are less expensive and/or provide modified performance when compared with the first insulating material. Both the first and second substrates will include complementary circuit patterns that will be electrically and physically connected to allow the composite substrate to function as a unitary substrate. The first and second substrates will also include connection regions that may be adapted for connection to printed circuit boards and/or electronic devices such as liquid crystal displays.

    摘要翻译： 提供了一种柔性膜封装模块及其制造方法，其可以适于以更低成本制造和/或适应特定应用的柔性膜封装模块的特性。 较低成本的柔性膜封装模块包括一个胶带，其将通常由较高成本的聚酰亚胺材料形成的第一绝缘基板和通常由绝缘材料形成的第二绝缘基板或较便宜的材料和/ 或者与第一绝缘材料相比提供改进的性能。 第一和第二基板都将包括互补的电路图案，其将被电和物理连接，以允许复合基板作为整体基板。 第一和第二基板还将包括可适于连接到印刷电路板和/或诸如液晶显示器的电子设备的连接区域。

    Low-cost flexible film package module and method of manufacturing the same
    3.
    发明申请
    Low-cost flexible film package module and method of manufacturing the same 审中-公开

    公开(公告)号：US20060268213A1

    公开(公告)日：2006-11-30

    申请号：US11501883

    申请日：2006-08-10

    申请人： Sa-Yoon Kang ,  Dong-Han Kim ,  Ye-Chung Chung

    发明人： Sa-Yoon Kang ,  Dong-Han Kim ,  Ye-Chung Chung

    IPC分类号： G02F1/1345

    CPC分类号： G02F1/13452 ,  H01L23/5387 ,  H01L2224/16 ,  H01L2924/07811 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/068 ,  H05K2201/10681 ,  H01L2924/00

    摘要： Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package module for specific applications. The lower-cost flexible film package module includes a tape film that combines both a first insulating substrate, typically formed from a higher-cost polyimide material, and a second insulating substrate, typically formed from an insulating material or materials that are less expensive and/or provide modified performance when compared with the first insulating material. Both the first and second substrates will include complementary circuit patterns that will be electrically and physically connected to allow the composite substrate to function as a unitary substrate. The first and second substrates will also include connection regions that may be adapted for connection to printed circuit boards and/or electronic devices such as liquid crystal displays.

    Low-cost flexible film package module and method of manufacturing the same
    6.
    发明申请
    Low-cost flexible film package module and method of manufacturing the same 有权
    低成本的柔性薄膜封装模块及其制造方法

    公开(公告)号：US20050040504A1

    公开(公告)日：2005-02-24

    申请号：US10862337

    申请日：2004-06-08

    申请人： Sa-Yoon Kang ,  Dong-Han Kim ,  Ye-Chung Chung

    发明人： Sa-Yoon Kang ,  Dong-Han Kim ,  Ye-Chung Chung

    IPC分类号： H01L21/60 ,  G02F1/13 ,  G02F1/1345 ,  H01L23/538 ,  H05K1/11 ,  H05K1/14 ,  H01L23/02

    CPC分类号： G02F1/13452 ,  H01L23/5387 ,  H01L2224/16 ,  H01L2924/07811 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/068 ,  H05K2201/10681 ,  H01L2924/00

    摘要： Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package module for specific applications. The lower-cost flexible film package module includes a tape film that combines both a first insulating substrate, typically formed from a higher-cost polyimide material, and a second insulating substrate, typically formed from an insulating material or materials that are less expensive and/or provide modified performance when compared with the first insulating material. Both the first and second substrates will include complementary circuit patterns that will be electrically and physically connected to allow the composite substrate to function as a unitary substrate. The first and second substrates will also include connection regions that may be adapted for connection to printed circuit boards and/or electronic devices such as liquid crystal displays.

    摘要翻译： 提供了一种柔性膜封装模块及其制造方法，其可以适于以更低成本制造和/或适应特定应用的柔性膜封装模块的特性。 较低成本的柔性膜封装模块包括一个胶带，其将通常由较高成本的聚酰亚胺材料形成的第一绝缘基板和通常由绝缘材料形成的第二绝缘基板或较便宜的材料和/ 或者与第一绝缘材料相比提供改进的性能。 第一和第二基板都将包括互补的电路图案，其将被电和物理连接，以允许复合基板作为整体基板。 第一和第二基板还将包括可适于连接到印刷电路板和/或诸如液晶显示器的电子设备的连接区域。

    Semiconductor package and method for its manufacture
    8.
    发明申请
    Semiconductor package and method for its manufacture 有权
    半导体封装及其制造方法

    公开(公告)号：US20060012026A1

    公开(公告)日：2006-01-19

    申请号：US11173853

    申请日：2005-06-30

    申请人： Suk-Chae Kang ,  Sa-Yoon Kang ,  Dong-Han Kim ,  Si-Hoon Lee

    发明人： Suk-Chae Kang ,  Sa-Yoon Kang ,  Dong-Han Kim ,  Si-Hoon Lee

    IPC分类号： H01L23/48

    CPC分类号： H01L23/50 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A semiconductor package includes a metal plate in which one or more openings are formed, the metal plate mounting a semiconductor chip and a printed wire pattern substrate, e.g. a PCB, mounting one or more decoupling capacitors. The semiconductor chip is in direct contact with the metal plate to improve thermal characteristics, and the substrate is supported by the metal plate to increase mechanical stability of the package. The one or more openings in the metal plate accommodate the passing therethrough of plural pins electrically connected via the printed wire pattern substrate to the semiconductor chip. The semiconductor package can be usefully applied to a digital micro-mirror device (DMD) semiconductor package for use in a projection display device.

    摘要翻译： 半导体封装包括其中形成有一个或多个开口的金属板，安装半导体芯片的金属板和印刷的线图案衬底，例如， PCB，安装一个或多个去耦电容器。 半导体芯片与金属板直接接触以改善热特性，并且基板由金属板支撑以增加封装的机械稳定性。 金属板中的一个或多个开口适应通过印刷的线图案基板电连接到半导体芯片的多个引脚的穿过。 半导体封装可以有用地应用于用于投影显示装置的数字微镜器件（DMD）半导体封装。

    Tape circuit substrate and semicondutor chip package using the same
    9.
    发明授权
    Tape circuit substrate and semicondutor chip package using the same 有权
    胶带电路基板和半导体芯片封装使用相同

    公开(公告)号：US07183660B2

    公开(公告)日：2007-02-27

    申请号：US10949091

    申请日：2004-09-23

    申请人： Si-Hoon Lee ,  Sa-Yoon Kang ,  Dong-Han Kim

    发明人： Si-Hoon Lee ,  Sa-Yoon Kang ,  Dong-Han Kim

    IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

    CPC分类号： H01L23/49572 ,  H01L23/3157 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2224/05599

    摘要： A tape circuit substrate comprises a base film made of an insulating material, and a wiring pattern layer which is formed on the base film and has first leads that are connected to electrode pads arranged near a periphery of a semiconductor chip and second leads that are connected to electrode pads arranged near the center of the semiconductor chip. The semiconductor chip package comprises a semiconductor chip electrically bonded to the tape circuit substrate through chip bumps. In such a case, each of the leads is configured such that a tip end thereof to be bonded to the electrode pad has a width larger than that of a body portion thereof. According to the present invention, since the interval between the lead and the electrode pad can be made even narrower, a fine pitch semiconductor device can be realized.

    摘要翻译： 带状电路基板包括由绝缘材料制成的基膜和形成在基膜上的布线图案层，并且具有连接到布置在半导体芯片的周围附近的电极焊盘的第一引线和连接的第二引线 到布置在半导体芯片的中心附近的电极焊盘。 半导体芯片封装包括通过芯片凸块电连接到带电路基板的半导体芯片。 在这种情况下，每个引线被构造成使得其与电极焊盘接合的前端的宽度大于其主体部分的宽度。 根据本发明，由于可以使引线与电极焊盘之间的间隔更窄，所以可以实现精细的间距半导体器件。