发明授权
US07329617B2 Coating for enhancing adhesion of molding compound to semiconductor devices
有权
用于增强模塑料对半导体器件的附着力的涂层
- 专利标题： Coating for enhancing adhesion of molding compound to semiconductor devices
- 专利标题（中）： 用于增强模塑料对半导体器件的附着力的涂层
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申请号： US11019421申请日： 2004-12-22
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公开(公告)号： US07329617B2公开(公告)日： 2008-02-12
- 发明人: Jianxiong Li , Chi Chuen Chaw , Ngai Kin Tsui , Deming Liu , Yiu Fai Kwan , Wai Chan
- 申请人： Jianxiong Li , Chi Chuen Chaw , Ngai Kin Tsui , Deming Liu , Yiu Fai Kwan , Wai Chan
- 申请人地址： HK Hong Kong
- 专利权人： ASM Assembly Automation Ltd.
- 当前专利权人： ASM Assembly Automation Ltd.
- 当前专利权人地址： HK Hong Kong
- 代理机构： Ostrolenk, Faber, Gerb & Soffen, LLP
- 主分类号： H01L21/31
- IPC分类号： H01L21/31
摘要：
A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be performed by dipping, dripping or spraying the semiconductor device in or with a polymer solution.
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