公开(公告)号：US08633089B2

公开(公告)日：2014-01-21

申请号：US13072869

申请日：2011-03-28

Applicant: Man Chung Ng ,  Keung Chau

Inventor： Man Chung Ng ,  Keung Chau

IPC: H01L21/00 ,  H01L21/30 ,  H01L21/46 ,  H01L21/66

CPC classification number: H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/7698

Abstract: An array of semiconductor components, comprising a first plurality of semiconductor components and a second plurality of semiconductor components held on a carrier, is bonded onto one or more substrates. The first plurality of semiconductor components is first located for pick-up by a transfer device, and each semiconductor component comprised in the first plurality of semiconductor components is picked up with the transfer device and is bonded onto a respective bonding position on the one or more substrates. After the first plurality of semiconductor components have been picked up and bonded, the carrier is rotated and the second plurality of semiconductor components is located for pick-up by the transfer device. Thereafter, each semiconductor component comprised in the second plurality of semiconductor components is picked up with the transfer device and is bonded onto a respective bonding position on the one or more substrates.

Abstract translation: 包括第一多个半导体部件和保持在载体上的第二多个半导体部件的半导体部件阵列被接合到一个或多个基板上。 第一多个半导体部件首先被定位用于由传送装置拾取，并且包含在第一多个半导体部件中的每个半导体部件被传送装置拾取并且被结合到一个或多个 底物。 在第一多个半导体部件被拾取和接合之后，载体旋转，并且第二多个半导体部件被定位用于由传送装置拾取。 此后，包含在第二多个半导体部件中的每个半导体部件被传送装置拾取并且结合到一个或多个基板上的相应的接合位置。

公开(公告)号：US08354612B2

公开(公告)日：2013-01-15

申请号：US12748578

申请日：2010-03-29

Applicant: Chi Wah Cheng ,  Lap Kei Chow ,  Zhuanyun Zhang ,  Sze Leong Lai

Inventor： Chi Wah Cheng ,  Lap Kei Chow ,  Zhuanyun Zhang ,  Sze Leong Lai

IPC: B23K26/00

CPC classification number: B23K26/0673 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/52 ,  H01L21/67092

Abstract: A laser processing apparatus for cutting substrates comprises a laser head for generating a laser beam and first and second work holders on which substrates are mountable. A diverter positioned along a path of the laser beam is operative to selectively direct the laser beam towards a first substrate mounted on the first work holder to cut the first substrate, or towards a second substrate mounted on the second work holder to cut the second substrate, so that contemporaneous operations may be conducted on one substrate while the other substrate is being cut.

Abstract translation: 用于切割基板的激光加工设备包括用于产生激光束的激光头和可安装基板的第一和第二工件保持器。 沿着激光束的路径定位的分流器可操作以选择性地将激光束引向安装在第一工件保持器上的第一基板，以切割第一基板，或朝向安装在第二工件保持器上的第二基板切割第二基板 从而可以在一个基板上同时进行操作，而另一个基板被切割。

公开(公告)号：US08141612B2

公开(公告)日：2012-03-27

申请号：US12417222

申请日：2009-04-02

Applicant: Man Wai Chan ,  Yuk Cheung Au ,  Kwok Wai Wong ,  Chi Ming Chong

Inventor： Man Wai Chan ,  Yuk Cheung Au ,  Kwok Wai Wong ,  Chi Ming Chong

IPC: B32B38/10

CPC classification number: H01L21/67132 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68336 ,  Y10S156/931 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/943 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1978 ,  Y10T156/1983 ,  Y10T156/1989

Abstract: A die detachment device for delaminating a die which is mounted at a position on an adhesive film comprises a plurality of movable plates having quadrilateral-shaped contact surfaces which are arranged adjacent to one another. The plurality of movable plates comprises an intermediate movable plate and outer movable plates on opposite sides of the intermediate movable plate. The contact surfaces of the movable plates together form a combined contact surface for supporting the adhesive film at the position of the die, each movable plate being movable relative to the other movable plates towards and away from the die.

Abstract translation: 用于剥离安装在粘合剂膜上的位置的管芯的脱模装置包括多个彼此相邻布置的具有四边形接触表面的活动板。 多个可动板包括中间可动板和在中间可动板的相对侧上的外部可动板。 可移动板的接触表面一起形成用于在模具的位置处支撑粘合剂膜的组合的接触表面，每个可移动板可相对于其它可移动板朝向和远离模具移动。

公开(公告)号：US08037996B2

公开(公告)日：2011-10-18

申请号：US12348508

申请日：2009-01-05

Applicant: Chi Wah Cheng ,  Wang Lung Tse ,  Chi Hang Leung

Inventor： Chi Wah Cheng ,  Wang Lung Tse ,  Chi Hang Leung

IPC: B65G25/00

CPC classification number: B65G47/918 ,  B65G47/91 ,  H01L21/67271

Abstract: An apparatus for transferring a plurality of electronic components includes a row of pick heads operative to pick up the electronic components simultaneously from a first location and to place them at a second location. Additionally, there is a driving mechanism operative to drive the pick heads to move relative to one another in directions which are parallel to a length of the row of pick heads whereby to adjust a pitch width of the pick heads.

Abstract translation: 用于传送多个电子部件的装置包括一排拾取头，其操作以从第一位置同时拾取电子部件并将其放置在第二位置。 此外，存在一种驱动机构，其可操作地驱动拾取头相对于彼此在与行列拾取头的长度平行的方向上相对移动，从而调节拾取头的间距宽度。

公开(公告)号：US07977231B1

公开(公告)日：2011-07-12

申请号：US12941174

申请日：2010-11-08

Applicant: Kui Kam Lam ,  Yen Hsi Tang ,  Yiu Yan Wong ,  Hok Man Wan

Inventor： Kui Kam Lam ,  Yen Hsi Tang ,  Yiu Yan Wong ,  Hok Man Wan

IPC: H01L21/44

CPC classification number: H01L21/6715 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L2224/27312 ,  H01L2224/29036 ,  H01L2224/2919 ,  H01L2224/743 ,  H01L2224/75611 ,  H01L2224/75744 ,  H01L2224/759 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665

Abstract: Adhesive is dispensed for conducting die bonding onto a substrate including rows of bond pads aligned along a first axis and columns of bond pads aligned along a second axis transverse to the first axis where target dispensing positions are located. A first dispensing head incorporating a first nozzle and a second dispensing head incorporating a second nozzle are provided and the substrate is fed along the first axis to a position where the first and second dispensing heads are located. Pattern recognition of a columnar section of the substrate comprising one or more consecutive columns of bond pads with an optical system may be conducted by moving the optical system along the second axis relative to the substrate. Thereafter, the first nozzle and the second nozzle are driven concurrently to dispense adhesive from the first and second nozzles onto the target dispensing positions in the same columnar section of the substrate.

Abstract translation: 粘合剂被分配用于导电管芯接合到基底上，该衬底包括沿着第一轴线排列的接合焊盘列，以及沿着与目标分配位置所在的第一轴线相交的第二轴线排列的接合焊盘列。 提供了包括第一喷嘴的第一分配头和结合有第二喷嘴的第二分配头，并且基板沿着第一轴线被供给到第一和第二分配头所在的位置。 可以通过沿相对于衬底的第二轴移动光学系统来进行包括具有光学系统的一个或多个连续的接合焊盘的衬底的柱状截面的图案识别。 此后，同时驱动第一喷嘴和第二喷嘴，以将粘合剂从第一和第二喷嘴分配到基板的相同柱状部分中的目标分配位置上。

公开(公告)号：US07733114B2

公开(公告)日：2010-06-08

申请号：US12255057

申请日：2008-10-21

Applicant: Chak Tong Albert Sze ,  Pei Wei Tsai ,  Sai Kit Wong ,  Wai Hong Sizto

Inventor： Chak Tong Albert Sze ,  Pei Wei Tsai ,  Sai Kit Wong ,  Wai Hong Sizto

IPC: G01R31/26

CPC classification number: G01R31/2893 ,  G01R31/2635

Abstract: A test handler is provided for testing electronic devices having light-emitting elements. Electronic devices are mounted at a loading position, optical measurements are conducted at a test contact position where a testing device is located for optical communication with the light-emitting elements and then tested electronic devices are removed at an unloading position. Multiple test contactors hold the electronic devices and move them to and through the loading position, test contact position and unloading position in sequence. Each test contactor comprises a device contact point including electrical conductors which are connected to electrical contacts of the electronic device when the electronic device is mounted at the device contact point, and a retaining mechanism grips the electronic device at the device contact point such that the retaining mechanism does not obstruct the optical communication between the testing device and the light-emitting element at the test contact position.

Abstract translation: 提供了一种用于测试具有发光元件的电子设备的测试处理器。 电子设备安装在加载位置，光学测量在测试设备所在的测试接触位置处进行，以与发光元件光学通信，然后在卸载位置移除测试的电子设备。 多个测试接触器握住电子设备，并将它们依次移动并穿过装载位置，测试接触位置和卸载位置。 每个测试接触器包括一个设备接触点，包括当电子设备安装在设备接触点时连接到电子设备的电触头的电导体，并且保持机构在设备接触点处夹持电子设备，使得保持 机构不会阻碍测试装置与测试接触位置处的发光元件之间的光通信。

公开(公告)号：US07676114B2

公开(公告)日：2010-03-09

申请号：US11305568

申请日：2005-12-16

Applicant: Chi Kit Ronald Chung ,  Jun Cheng ,  Y. Edmund Lam ,  Shun Ming Kenneth Fung ,  Fan Wang ,  Wing Hong Leung

Inventor： Chi Kit Ronald Chung ,  Jun Cheng ,  Y. Edmund Lam ,  Shun Ming Kenneth Fung ,  Fan Wang ,  Wing Hong Leung

IPC: G01B11/24 ,  G06K9/00

CPC classification number: G01B11/2527

Abstract: A system for three-dimensional reconstruction of a surface profile of a surface of an object is provided that utilizes a binary pattern projected onto the surface of the object. A binary string consisting of a series of “1”s and “0”s is first created, and a binary pattern of light that is constructed in accordance with the binary string such that bright and dark bands of light of equal widths correspond to “1”s and “0”s from the binary string respectively is projected onto the surface. The binary pattern is shifted with respect to the surface multiple times, during which an image of the binary pattern illuminating the surface is obtained at each position of the binary pattern. Thereafter, a height of each predetermined point on the surface is calculated relative to a reference plane based upon the images cumulatively obtained at said predetermined point.

Abstract translation: 提供了一种用于物体表面的表面轮廓的三维重建的系统，其利用投影到物体表面上的二进制图案。 首先创建由一系列“1”和“0”组成的二进制串，以及根据二进制串构造的二进制图案，使得相等宽度的明暗的光带对应于“ 分别将二进制串的“1”和“0”投影到表面上。 二进制图案相对于表面多次移位，在此期间，在二进制图案的每个位置处获得照亮表面的二进制图案的图像。 此后，基于在所述预定点累积获得的图像，相对于参考平面计算表面上的每个预定点的高度。

公开(公告)号：US07495759B1

公开(公告)日：2009-02-24

申请号：US11877099

申请日：2007-10-23

Applicant: Chi Wah Cheng ,  Lap Kei Eric Chow

Inventor： Chi Wah Cheng ,  Lap Kei Eric Chow

IPC: G01N21/00 ,  B24B49/00

CPC classification number: B23D59/001 ,  B24B27/06 ,  B24B49/12 ,  G01N2021/151

Abstract: A method of detecting wear and damage to a rotary cutting blade for singulating a substrate is provided comprising the steps of providing a sensor to locate a first detecting position at an edge of the blade and performing dicing with the blade while the sensor is maintained substantially at the first detecting position for detecting damage to the blade. Subsequently, an extent of wear of the blade is determined by driving the sensor in the direction of the blade to locate a second detecting position at the edge of the blade as a diameter of the blade is reduced due to dicing. Thereafter, while dicing is performed with the blade, the sensor is maintained substantially at the second detecting position for detecting damage to the blade.

Abstract translation: 提供一种检测用于单个基板的旋转切割刀片的磨损和损坏的方法，包括以下步骤：提供传感器以在刀片的边缘定位第一检测位置，并且在传感器基本保持在基座上时与刀片进行切割 用于检测对刀片的损坏的第一检测位置。 随后，通过沿着刀片的方向驱动传感器来确定刀片的磨损程度，以便由于切割而使刀片的直径减小，从而将刀片的边缘处的第二检测位置定位。 此后，当用刀片进行切割时，传感器基本上保持在第二检测位置，用于检测刀片的损坏。

公开(公告)号：US20070278864A1

公开(公告)日：2007-12-06

申请号：US11442886

申请日：2006-05-30

Applicant: Wing Chiu Derek Lai ,  Cheuk Wah Chester Tang ,  Yen Hsi Terry Tang ,  Ming Lok Benjamin Yeung

Inventor： Wing Chiu Derek Lai ,  Cheuk Wah Chester Tang ,  Yen Hsi Terry Tang ,  Ming Lok Benjamin Yeung

IPC: H02K41/00

CPC classification number: H02K41/03 ,  H02K5/20 ,  H02K9/04

Abstract: A cooling apparatus is provided for a linear motor that comprises a coil assembly and a magnet assembly, wherein the coil assembly generates heat during operation. The cooling apparatus comprises a compressed air inlet positioned to discharge compressed air in a direction directly towards a gap between the coil assembly and magnet assembly, and an inclined surface extending from the compressed air inlet and sloping at an obtuse angle away from the discharge direction of the compressed air. The compressed air inlet is configured to discharge the compressed air at a sufficient velocity so as to entrain atmospheric air along the inclined surface to amplify the compressed air that is discharged.

Abstract translation: 为包括线圈组件和磁体组件的线性电动机提供冷却装置，其中线圈组件在操作期间产生热量。 冷却装置包括压缩空气入口，其被定位成沿着直接朝向线圈组件和磁体组件之间的间隙的方向排出压缩空气，以及从压缩空气入口延伸的倾斜表面，并以钝角倾斜远离排出方向 压缩空气。 压缩空气入口被配置为以足够的速度排出压缩空气，以沿着倾斜表面夹带大气，以放大被排出的压缩空气。

公开(公告)号：US07240711B2

公开(公告)日：2007-07-10

申请号：US10762826

申请日：2004-01-21

Applicant: Lai Wa Helen Chan ,  Siu Hong Choy ,  Chou Kee Peter Liu ,  Ming Wai Kelvin Ng ,  Yuk Cheung Au

Inventor： Lai Wa Helen Chan ,  Siu Hong Choy ,  Chou Kee Peter Liu ,  Ming Wai Kelvin Ng ,  Yuk Cheung Au

IPC: B32B41/00 ,  G01L5/16

CPC classification number: H01L21/67259 ,  H01L21/67092 ,  H01L21/68

Abstract: The invention provides an apparatus and method for aligning a bonding tool. A force sensor having a plurality of force sensing sections is configured to measure a force generated by the bonding tool on the force sensor. Each sensing section is adapted to individually detect an amount of force from a part of the bonding tool acting on that sensing section, so that an alignment of the bonding tool may be determined.

Abstract translation: 本发明提供了一种用于对准接合工具的装置和方法。 具有多个力感测部分的力传感器被配置为测量由力传感器上的接合工具产生的力。 每个感测部分适于单独地检测来自作用在该感测部分上的接合工具的一部分的力的量，从而可以确定接合工具的对准。