发明授权
- 专利标题: Soldering a die to a substrate
- 专利标题(中): 将模具焊接到基板上
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申请号: US11170188申请日: 2005-06-29
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公开(公告)号: US07332423B2公开(公告)日: 2008-02-19
- 发明人: Robert Starkston , Sridhar Narasimhan , Chia-Pin Chiu , Suzana Prstic , Patrick N Stover , Hong Xie
- 申请人: Robert Starkston , Sridhar Narasimhan , Chia-Pin Chiu , Suzana Prstic , Patrick N Stover , Hong Xie
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwegman, Lundberg & Woessner, P.A.
- 主分类号: H01L21/44
- IPC分类号: H01L21/44
摘要:
One example electronic assembly includes a substrate that has a plurality of contacts which become bonded to a plurality of contacts on a die. The electronic assembly further includes a male member that extends from at least one of the substrate and the die and a female member that extends from the other of the substrate and the die. The male member is inserted into the female member to align the die relative to the substrate. The male member and the female member may have any configuration as long as one or more portions of the male member extend partially, or wholly, into the female member. An example method includes aligning a die relative to a substrate by inserting a male member that extends from one of the die and the substrate into a female member that extends from the other of the die and the substrate.
公开/授权文献
- US20070001318A1 Soldering a die to a substrate 公开/授权日:2007-01-04
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