Invention Grant
US07334602B2 Apparatus for controlling flow rate of gases used in semiconductor device by differential pressure
有权
用于通过差压来控制半导体器件中使用的气体的流量的装置
- Patent Title: Apparatus for controlling flow rate of gases used in semiconductor device by differential pressure
- Patent Title (中): 用于通过差压来控制半导体器件中使用的气体的流量的装置
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Application No.: US10562158Application Date: 2004-06-24
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Publication No.: US07334602B2Publication Date: 2008-02-26
- Inventor: Kang-Ho Ahn
- Applicant: Kang-Ho Ahn
- Applicant Address: KR Kyungki-Do KR Seoul
- Assignee: Hyundai Calibration & Certification Technologies Co., Ltd.,Kang-Ho Ahn
- Current Assignee: Hyundai Calibration & Certification Technologies Co., Ltd.,Kang-Ho Ahn
- Current Assignee Address: KR Kyungki-Do KR Seoul
- Agency: Lowe Hauptman Ham & Berner
- Priority: KR10-2003-0042584 20030627
- International Application: PCT/KR2004/001533 WO 20040624
- International Announcement: WO2005/001911 WO 20050106
- Main IPC: G05D7/06
- IPC: G05D7/06

Abstract:
Provided is apparatus for controlling flow rate of gases used in semiconductor device by differential pressure by generating differential pressure in a fluid path. A differential pressure generation element generates pressure difference in the fluid path of gases used in semiconductor device fabrication, a pressure, sensor which is installed at a bypass of the fluid path detects the pressure difference, and a central processing unit (CPU) measures and controls a flow rate of the gases, thereby the present invention is capable of controlling the flow rate precisely and rapidly, and enhancing the degree of purity of the gases by the filtering function of the differential pressure generation element itself.
Public/Granted literature
- US20060151113A1 Apparatus for controlling flow rate of gases used in semiconductor deivce by differential pressure Public/Granted day:2006-07-13
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