发明授权
- 专利标题: Non-contact IC module
- 专利标题(中): 非接触式IC模块
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申请号: US09769293申请日: 2001-01-26
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公开(公告)号: US07334734B2公开(公告)日: 2008-02-26
- 发明人: Yoshiharu Hino , Kazuhiko Daido
- 申请人: Yoshiharu Hino , Kazuhiko Daido
- 申请人地址: JP Osaka
- 专利权人: Hitachi Maxwell, Ltd.
- 当前专利权人: Hitachi Maxwell, Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 优先权: JP2000-019042 20000127; JP2000-046325 20000223
- 主分类号: G06K19/06
- IPC分类号: G06K19/06
摘要:
An accessed object having a non-contact IC module including a semiconductor device and a module-side antenna formed extending over two sides of an accessed object, wherein the module-side antenna consists of a first module-side antenna and a second module-side antenna continuous to the first module-side antenna, wherein the first module-side antenna secures a necessary antenna effective area by coming into face-to-face relation with a first apparatus-side antenna on communication apparatus to communicate with the accessed object, and wherein the second module-side antenna is disposed close to the second apparatus-side antenna in an access direction different from the direction in which the first apparatus-side antenna makes access to the accessed object.
公开/授权文献
- US20010011012A1 Non-contact IC module 公开/授权日:2001-08-02
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