Invention Grant
- Patent Title: Microfluidics chips and methods of using same
- Patent Title (中): 微流体芯片及其使用方法
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Application No.: US10631488Application Date: 2003-07-31
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Publication No.: US07335984B2Publication Date: 2008-02-26
- Inventor: Victor Samper , Lin Cong , Hongmiao Ji
- Applicant: Victor Samper , Lin Cong , Hongmiao Ji
- Applicant Address: SG Singapore SG Singapore
- Assignee: Agency For Science, Technology and Research,National University of Singapore
- Current Assignee: Agency For Science, Technology and Research,National University of Singapore
- Current Assignee Address: SG Singapore SG Singapore
- Agency: Winstead PC
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
Microfluidics chips and methods of use are described, comprising a pair of wafers, at least one having a patterned surface, and two polymeric barrier films between the wafers conforming to the patterned surface. The polymeric barrier films allow the wafers of the inventive microfluidics chips to be reused without cleaning.
Public/Granted literature
- US20050022888A1 Microfluidics chips and methods of using same Public/Granted day:2005-02-03
Information query
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