发明授权
- 专利标题： Stack type surface acoustic wave package, and method for manufacturing the same
- 专利标题（中）： 堆叠式表面声波封装及其制造方法
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申请号： US11217465申请日： 2005-09-02
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公开(公告)号： US07336017B2公开(公告)日： 2008-02-26
- 发明人: Seung Hee Lee , Doo Cheol Park , Joo Hun Park , Young Jin Lee , Sang Wook Park , Nam Hyeong Kim
- 申请人： Seung Hee Lee , Doo Cheol Park , Joo Hun Park , Young Jin Lee , Sang Wook Park , Nam Hyeong Kim
- 申请人地址： KR Kyungki-Do
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Kyungki-Do
- 代理机构： Lowe Hauptman Ham & Berner
- 优先权： KR10-2005-0038093 20050506
- 主分类号： H03H9/25
- IPC分类号： H03H9/25
摘要：
A surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connecting portion electrically connecting the first bare chip to an upper surface of the second bare chip such that the electrodes of the first bare chip face the electrodes of the second bare chip, and a sealing member provided on the first and second bare chips to form an air-tight space on an operating surface between the first and second bare chips.
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