公开(公告)号：US20100047949A1

公开(公告)日：2010-02-25

申请号：US12546142

申请日：2009-08-24

申请人： Seung Hee Lee ,  Doo Cheol Park ,  Joo Hun Park ,  Young Jin Lee ,  Sang Wook Park ,  Nam Hyeong Kim

发明人： Seung Hee Lee ,  Doo Cheol Park ,  Joo Hun Park ,  Young Jin Lee ,  Sang Wook Park ,  Nam Hyeong Kim

IPC分类号： H01L21/50

CPC分类号： H03H9/1085 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H03H3/08 ,  H03H9/059 ,  H03H9/1078 ,  H01L2224/81 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Disclosed herein is a stack type surface acoustic wave package. The surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connecting portion electrically connecting the first bare chip to an upper surface of the second bare chip such that the electrodes of the first bare chip face the electrodes of the second bare chip, and a sealing member provided on the first and second bare chips to form an air-tight space on an operating surface between the first and second bare chips. The surface acoustic wave package can prevent deformation due to thermal impact from the outside during a packaging process, enhancing reliability of the product, minimizing the size of the product, and reducing manufacturing costs by reducing the number of components and material costs.

摘要翻译： 这里公开了一种堆叠型表面声波封装。 表面声波封装包括具有形成在其上的多个电极的第一裸芯片，具有形成在其上的多个电极和通孔的第二裸芯片，将第一裸芯片电连接到第二裸芯片的上表面的连接部分 裸芯片，使得第一裸芯片的电极面对第二裸芯片的电极;以及密封构件，设置在第一裸芯片和第二裸芯片上，以在第一和第二裸芯片之间的操作表面上形成气密空间 。 表面声波封装可以防止在包装过程中由于外界的热冲击而引起的变形，提高产品的可靠性，最小化产品尺寸，并通过减少部件数量和材料成本降低制造成本。

公开(公告)号：US07336017B2

公开(公告)日：2008-02-26

申请号：US11217465

申请日：2005-09-02

申请人： Seung Hee Lee ,  Doo Cheol Park ,  Joo Hun Park ,  Young Jin Lee ,  Sang Wook Park ,  Nam Hyeong Kim

发明人： Seung Hee Lee ,  Doo Cheol Park ,  Joo Hun Park ,  Young Jin Lee ,  Sang Wook Park ,  Nam Hyeong Kim

IPC分类号： H03H9/25

CPC分类号： H03H9/1085 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H03H3/08 ,  H03H9/059 ,  H03H9/1078 ,  H01L2224/81 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connecting portion electrically connecting the first bare chip to an upper surface of the second bare chip such that the electrodes of the first bare chip face the electrodes of the second bare chip, and a sealing member provided on the first and second bare chips to form an air-tight space on an operating surface between the first and second bare chips.

摘要翻译： 表面声波封装包括其上形成有多个电极的第一裸芯片，形成有多个电极和通孔的第二裸芯片，将第一裸芯片电连接到第二裸芯片的上表面的连接部分 裸芯片，使得第一裸芯片的电极面对第二裸芯片的电极;以及密封构件，设置在第一裸芯片和第二裸芯片上，以在第一和第二裸芯片之间的操作表面上形成气密空间 。

公开(公告)号：US07820468B2

公开(公告)日：2010-10-26

申请号：US12546142

申请日：2009-08-24

申请人： Seung Hee Lee ,  Doo Cheol Park ,  Joo Hun Park ,  Young Jin Lee ,  Sang Wook Park ,  Nam Hyeong Kim

发明人： Seung Hee Lee ,  Doo Cheol Park ,  Joo Hun Park ,  Young Jin Lee ,  Sang Wook Park ,  Nam Hyeong Kim

IPC分类号： H01L21/782

CPC分类号： H03H9/1085 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H03H3/08 ,  H03H9/059 ,  H03H9/1078 ,  H01L2224/81 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Disclosed herein is a stack type surface acoustic wave package. The surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connecting portion electrically connecting the first bare chip to an upper surface of the second bare chip such that the electrodes of the first bare chip face the electrodes of the second bare chip, and a sealing member provided on the first and second bare chips to form an air-tight space on an operating surface between the first and second bare chips. The surface acoustic wave package can prevent deformation due to thermal impact from the outside during a packaging process, enhancing reliability of the product, minimizing the size of the product, and reducing manufacturing costs by reducing the number of components and material costs.

摘要翻译： 这里公开了一种堆叠型表面声波封装。 表面声波封装包括具有形成在其上的多个电极的第一裸芯片，具有形成在其上的多个电极和通孔的第二裸芯片，将第一裸芯片电连接到第二裸芯片的上表面的连接部分 裸芯片，使得第一裸芯片的电极面对第二裸芯片的电极;以及密封构件，设置在第一裸芯片和第二裸芯片上，以在第一和第二裸芯片之间的操作表面上形成气密空间 。 表面声波封装可以防止在包装过程中由于外界的热冲击而引起的变形，提高产品的可靠性，最小化产品尺寸，并通过减少部件数量和材料成本降低制造成本。

公开(公告)号：US08431442B2

公开(公告)日：2013-04-30

申请号：US13253425

申请日：2011-10-05

申请人： Sang Wook Park ,  Tae Gyeong Chung ,  Ho Geon Song ,  Won Chul Lim

发明人： Sang Wook Park ,  Tae Gyeong Chung ,  Ho Geon Song ,  Won Chul Lim

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacturing semiconductor chips includes providing a semiconductor substrate including circuit regions, irradiating the semiconductor substrate with a laser beam onto to form a frangible layer, and polishing the semiconductor substrate to separate the circuit regions of the semiconductor substrate from one another into semiconductor chips. The frangible layer may be removed completely during the polishing of the semiconductor substrate.

摘要翻译： 制造半导体芯片的方法包括提供包括电路区域的半导体衬底，用激光束照射半导体衬底以形成易碎层，以及抛光半导体衬底以将半导体衬底的电路区域彼此分离为半导体芯片 。 在半导体衬底的抛光期间可以完全去除易碎层。

公开(公告)号：US08311401B2

公开(公告)日：2012-11-13

申请号：US12490541

申请日：2009-06-24

申请人： Sang Wook Park ,  Noh Sam Park ,  Jong Hyun Jang ,  Eui Hyun Paik ,  Kwang Roh Park

发明人： Sang Wook Park ,  Noh Sam Park ,  Jong Hyun Jang ,  Eui Hyun Paik ,  Kwang Roh Park

IPC分类号： H04N5/77

CPC分类号： G11B27/10 ,  H04N5/782 ,  H04N5/84

摘要： Provided are a multimedia playing system and a method for playing multimedia using the system. The system includes a first multimedia player, a second multimedia player, and a user interface. The first multimedia player includes a first media controller controlling plays of a first video and a first audio in response to multimedia data received from an external device. The second multimedia player includes a second media controller operating independently of the first multimedia player and controlling plays of second video in response to the multimedia data. The user interface transmits synchronization information to the first and second media controller.

摘要翻译： 提供了一种多媒体播放系统和使用该系统播放多媒体的方法。 该系统包括第一多媒体播放器，第二多媒体播放器和用户界面。 第一多媒体播放器包括响应于从外部设备接收的多媒体数据来控制第一视频和第一音频的播放的第一媒体控制器。 第二多媒体播放器包括独立于第一多媒体播放器操作的第二媒体控制器，并响应多媒体数据控制第二视频的播放。 用户界面向第一和第二媒体控制器发送同步信息。

公开(公告)号：US07581553B2

公开(公告)日：2009-09-01

申请号：US11271340

申请日：2005-11-10

申请人： Ki Hun Kim ,  Seong Keun Lim ,  Hyun Chul Lee ,  Sang Wook Park

发明人： Ki Hun Kim ,  Seong Keun Lim ,  Hyun Chul Lee ,  Sang Wook Park

IPC分类号： B08B3/02

CPC分类号： B08B3/02 ,  A23N12/02 ,  B05B1/14 ,  B05B17/0646 ,  B08B3/12 ,  B08B2203/0288

摘要： Disclosed herein is a domestic injection-type ultrasonic washing apparatus comprising an oscillator module and an injector module. The oscillator module includes an oscillation circuit unit provided with various elements to generate electric vibration, ultrasonic vibrators located underneath the oscillation circuit unit and electrically connected to the oscillation circuit unit to convert the electric vibration to mechanical vibration, and a radiation plate having vibrator seating openings. The injector module includes a raw water inlet portion, a fluid passage housing having an inner fluid passage to allow inlet raw water to pass while coming into contact with the radiation plate, and injection nozzles to ultrasonically vibrate and inject the raw water. The washing apparatus achieves reduction in the size thereof, and ease of assembly, repair and exchange of damaged modules. Also, the washing apparatus shows improved radiation effect and uniform supply of wash water.

摘要翻译： 本文公开了一种家用注射型超声波清洗装置，其包括振荡器模块和注射器模块。 所述振荡器模块包括具有产生电振动的各种元件的振荡电路单元，位于所述振荡电路单元下方并与振荡电路单元电连接以将电振动转换为机械振动的超声波振子，以及具有振动器座部开口 。 喷射器模块包括原水入口部分，流体通道壳体，其具有内部流体通道，以允许入口原水在与辐射板接触的同时通过;以及喷嘴，用于超声振动并注入原水。 洗涤装置的尺寸减小，易于组装，修理和损坏的模块的更换。 此外，洗涤装置显示改善的辐射效果和洗涤水的均匀供应。

公开(公告)号：US20080272373A1

公开(公告)日：2008-11-06

申请号：US12172321

申请日：2008-07-14

申请人： Ki Hong Yang ,  Sang Wook Park

发明人： Ki Hong Yang ,  Sang Wook Park

IPC分类号： H01L29/788

CPC分类号： H01L27/11541 ,  H01L27/105 ,  H01L27/11526

摘要： A flash memory device has a resistivity measurement pattern and method of forming the same. A trench is formed in an isolation film in a Self-Aligned Floating Gate (SAFG) scheme. The trench is buried to form a resistivity measurement floating gate. This allows the resistivity of the floating gate to be measured even in the SAFG scheme. Contacts for resistivity measurement are directly connected to the resistivity measurement floating gate. Therefore, variation in resistivity measurement values, which is incurred by the parasitic interface, can be reduced.

摘要翻译： 闪速存储器件具有电阻率测量图案及其形成方法。 在自对准浮动门（SAFG）方案中的隔离膜中形成沟槽。 埋入沟槽以形成电阻率测量浮栅。 这允许甚至在SAFG方案中测量浮动栅极的电阻率。 用于电阻率测量的触点直接连接到电阻率测量浮栅。 因此，可以减少由寄生接口引起的电阻率测量值的变化。

公开(公告)号：US06828686B2

公开(公告)日：2004-12-07

申请号：US10423872

申请日：2003-04-28

申请人： Sang Wook Park

发明人： Sang Wook Park

IPC分类号： H01L2348

CPC分类号： H01L24/05 ,  H01L21/56 ,  H01L23/3185 ,  H01L23/49575 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48463 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A chip size stack package includes two semiconductor chips arranged such that their bond pads-forming surfaces are opposed and insulating layers are applied thereto. Via-holes for exposing bond pads are formed in the insulating layers. Metal traces exposed at both sides of the insulating layers are formed on the via-holes, whereby the insulating layers are bonded to each other and the metal traces are bonded to each other. Ends of metal wires are connected to the metal traces exposed at the insulating layers, and both sides of the chips are molded by an encapsulate leaving the other ends of the metal wires exposed.

摘要翻译： 芯片尺寸堆叠封装包括两个半导体芯片，其布置成使得它们的焊盘形成表面相对并且绝缘层被施加到其上。 用于暴露接合焊盘的通孔形成在绝缘层中。 在通孔上形成在绝缘层的两侧露出的金属迹线，由此绝缘层彼此接合并且金属迹线彼此接合。 金属线的端部连接到暴露在绝缘层处的金属迹线，并且芯片的两侧通过封装模制，从而暴露出金属线的另一端。

公开(公告)号：US06777434B2

公开(公告)日：2004-08-17

申请号：US10439487

申请日：2003-05-16

申请人： Il Hwan Cho ,  Jee Woong Lim ,  Sang Wook Park ,  Ji Young Noh ,  Hyung Chul Ryu ,  Jong Hoon Kim ,  Myeong Yun Chae ,  Hyun Jung Park ,  Sung Hak Jung ,  Kyu Jeong Yeon ,  Hae Tak Jin

发明人： Il Hwan Cho ,  Jee Woong Lim ,  Sang Wook Park ,  Ji Young Noh ,  Hyung Chul Ryu ,  Jong Hoon Kim ,  Myeong Yun Chae ,  Hyun Jung Park ,  Sung Hak Jung ,  Kyu Jeong Yeon ,  Hae Tak Jin

IPC分类号： A61K31426

CPC分类号： C07D277/14

摘要： A thiazolidine-4-one derivative of formula 1 or a non-toxic salt thereof, a preparation method thereof, and a pharmaceutical composition containing the derivative or the salt as an active ingredient are provided: wherein: R1 and R2 each independently represent hydrogen, C1-C3 alkyl, halogen, methyl substituted with halogen, C1-C3 alkoxy substituted with halogen, cyano, or nitro.

摘要翻译： 提供式1的噻唑烷-4-酮衍生物或其无毒盐，其制备方法和含有该衍生物或盐作为活性成分的药物组合物：其中：R 1和R 2 各自独立地表示氢，C1-C3烷基，卤素，被卤素取代的甲基，被卤素，氰基或硝基取代的C1-C3烷氧基。

公开(公告)号：US06714466B2

公开(公告)日：2004-03-30

申请号：US10080710

申请日：2002-02-25

申请人： Sang Wook Park ,  Joo Hyung Mun ,  Hyeok Man Kwon

发明人： Sang Wook Park ,  Joo Hyung Mun ,  Hyeok Man Kwon

IPC分类号： G11C700

CPC分类号： G11C29/72 ,  G11C29/44

摘要： Two temporary buffers are employed alternatively storing a fail address data designated from a test operation, in which one of the temporary buffers transfers the fail address data to a data buffer in order to perform a repair analysis while the other one is storing the fail address data. Accordingly, the test and repair analysis operations are simultaneously performed. The capability of the rearrangement that includes the movement and exchange between the column and row fail address data enhances redundancy efficiency and yields of the memory device.

摘要翻译： 采用两个临时缓冲器，其中存储从测试操作指定的故障地址数据，其中一个临时缓冲器将故障地址数据传送到数据缓冲器，以执行修复分析，而另一个存储故障地址数据 。 因此，同时执行测试和修复分析操作。 包括列和行失败地址数据之间的移动和交换的重新布置的能力提高了存储器件的冗余效率和产量。