A suspension board with circuit having a conductor layer formed in the form of a fine wiring circuit by an additive process, while providing a reduced risk of damage and breaking of the conductor layer in a flying lead portion. The suspension board with circuit comprises a supporting board 2, an insulating base layer 3 formed on the supporting board 2, a conductor layer 4 formed on the insulating base layer 3, an insulating cover layer 5 formed on the conductor layer 4, and a flying lead portion 9 in which a supporting-board-side opening 13, a base-layer-side opening 14, and a cover-layer-side opening 15 are formed so that both sides of the conductor layer 4 can be exposed therefrom. A reinforcing portion 16 or 23 for reinforcing the conductor layer 4 formed continuously from at least either of the insulating base layer 3 and the insulating cover layer 5 along the longitudinal direction of the conductor layer 4 is included in the flying lead portion 9.