发明授权
- 专利标题： Side-emitting LED package and manufacturing method of the same
- 专利标题（中）： 侧面发光LED封装及其制造方法相同
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申请号： US11444397申请日： 2006-06-01
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公开(公告)号： US07338823B2公开(公告)日： 2008-03-04
- 发明人: Kyung Taeg Han , Hun Joo Hahm , Dae Yeon Kim , Ho Sik Ahn , Seong Yeon Han , Young Sam Park , Seon Goo Lee
- 申请人： Kyung Taeg Han , Hun Joo Hahm , Dae Yeon Kim , Ho Sik Ahn , Seong Yeon Han , Young Sam Park , Seon Goo Lee
- 申请人地址： KR Kyungki-Do
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Kyungki-Do
- 代理机构： McDermott Will & Emery LLP
- 优先权： KR10-2005-0046796 20050601
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/48
摘要：
The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.