发明授权
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
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申请号： US11712456申请日： 2007-03-01
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公开(公告)号： US07339259B2公开(公告)日： 2008-03-04
- 发明人: Fujio Ito , Hiromichi Suzuki
- 申请人： Fujio Ito , Hiromichi Suzuki
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2003-141911 20030520
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/48
摘要：
A semiconductor device has an improved mounting reliability and has external terminals formed by exposing portions of leads from a back surface of a resin sealing member. End portions on one side of the leads are fixed to a back surface of a semiconductor chip, and portions of the leads positioned outside the semiconductor chip are connected with electrodes formed on the semiconductor chip through wires.
公开/授权文献
- US20070145570A1 Semiconductor device 公开/授权日：2007-06-28
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