发明授权
US07339262B2 Tape circuit substrate and semiconductor apparatus employing the same
有权
带状电路基板及使用该电路基板的半导体装置
- 专利标题： Tape circuit substrate and semiconductor apparatus employing the same
- 专利标题（中）： 带状电路基板及使用该电路基板的半导体装置
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申请号： US10900211申请日： 2004-07-28
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公开(公告)号： US07339262B2公开(公告)日： 2008-03-04
- 发明人: Dae-Woo Son , Sa-Yoon Kang , Kwan-Jai Lee
- 申请人： Dae-Woo Son , Sa-Yoon Kang , Kwan-Jai Lee
- 申请人地址： KR Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd
- 当前专利权人： Samsung Electronics Co., Ltd
- 当前专利权人地址： KR Gyeonggi-do
- 代理机构： Harness, Dickey & Pierce, PLC
- 优先权： KR10-2003-0077570 20031104
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A tape circuit substrate and semiconductor apparatus employing the same, and a method for forming a tape circuit substrate may reduce or eliminate electromagnetic interference (EMI) and provide a substrate or apparatus which can supply a more stable power supply voltage. The tape circuit substrate may include an insulation film and a wiring pattern formed on the insulation film to define an electronic device-mounting region and including a ground electrode. The tape circuit substrate may include a ground electrode pattern formed at the electronic device-mounting region so as to be insulated from the wiring pattern, except where the ground electrode pattern is connected to the ground electrode.
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