发明授权
- 专利标题： Thermal dissipation from a flip chip through an aperture in a flex cable
- 专利标题（中）： 倒装芯片通过柔性电缆中的孔的散热
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申请号： US11500567申请日： 2006-08-08
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公开(公告)号： US07339268B1公开(公告)日： 2008-03-04
- 发明人: Shufun Ho , Alex Y. Tsay , Ali Hosseinzadeh , Dennis W. Hogg , Chee Shu Tay
- 申请人： Shufun Ho , Alex Y. Tsay , Ali Hosseinzadeh , Dennis W. Hogg , Chee Shu Tay
- 申请人地址： US CA Lake Forest
- 专利权人： Western Digital Technologies, Inc.
- 当前专利权人： Western Digital Technologies, Inc.
- 当前专利权人地址： US CA Lake Forest
- 代理机构： Carr & Ferrell LLP
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
A semiconductor die mounted to a flex cable is provided. The flex cable comprises a heat sink layer and a flex cable substrate having conductive traces disposed thereon. The flex cable substrate includes an aperture aligned with the semiconductor die. A thermal conductor disposed within the aperture contacts both the semiconductor die and the heat sink layer. The thermal conductor can comprise, for example, a set of solder balls.
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