发明授权
- 专利标题： Method for transferring a semiconductor body from a growth substrate to a support material
- 专利标题（中）： 将半导体本体从生长衬底转移到支撑材料的方法
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申请号： US11244802申请日： 2005-10-06
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公开(公告)号： US07341925B2公开(公告)日： 2008-03-11
- 发明人: Michael Kelly , Oliver Ambacher , Martin Stutzmann , Martin Brandt , Roman Dimitrov , Robert Handschuh
- 申请人： Michael Kelly , Oliver Ambacher , Martin Stutzmann , Martin Brandt , Roman Dimitrov , Robert Handschuh
- 申请人地址： DE münchen
- 专利权人： Osram GmbH
- 当前专利权人： Osram GmbH
- 当前专利权人地址： DE münchen
- 代理机构： Cohen Pontani Lieberman & Pavane LLP
- 优先权： DE19640594 19961001
- 主分类号： H01L21/46
- IPC分类号： H01L21/46
摘要：
A method for transferring a semiconductor body selected from the group consisting of a semiconductor layer, a semiconductor layer sequence or a semiconductor layer structure from a growth substrate to a support material. An interface between the growth substrate and the semiconductor body or a region in the vicinity of the interface is exposed to electromagnetic radiation through one of the semiconductor body and the growth substrate. A material at or in proximity to the interface is decomposed by absorption of the electromagnetic radiation in proximity to or at the interface so that the semiconductor body can be separated from the growth substrate. The semiconductor body is connected to the support material.